Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof

ABSTRACT

Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to form a light window; a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the light window; said first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to said first portion surface; a first angle between said first partial surface and the optical axis of the camera module is greater than a second angle between the second partial surface and the optical axis; a second end side opposite to and away from the flexible region of the molding base has a second side surface facing the light window; said second side surface comprises a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected to said third portion surface; a third angle between the third partial surface and the optical axis is greater than a fourth angle between the fourth partial surface and the optical axis.

FIELD OF THE INVENTION

The present application relates to field of camera modules, and furtherrelates to a photosensitive assembly and a photosensitive assemblyjointed panel manufactured by a molding process, a manufacturing methodthereof, and a camera module having the photosensitive assembly.

BACKGROUND OF THE INVENTION

Molding and packaging technology of a camera module is a newly developedpackaging technology based on traditional COB packaging. As shown inFIGS. 1A to 1C, a circuit board is packaged by using the existingintegrated packaging technology. In this structure, a packaging portion1 is packaged in a circuit board 2 and a photosensitive chip 3 by anintegrated packaging way to form an integrated packaging assembly, andthe packaging portion 1 covers a plurality of electronic components 201of the circuit board 2 and a series of leads 202 electrically connectingthe photosensitive chip 3 and the circuit board 2, which enables thelength, width, and thickness dimensions of the camera module to bereduced, and assembly tolerances can be reduced, and a lens or a lensassembly positioned above the integrated packaging assembly can bemounted flatly and the problem that dust attached to the electroniccomponents affects the imaging quality of the camera module is solved.

More specifically, as shown in FIGS. 1A and 1B, in order to improveproduction efficiency, the integrated packaging assembly is generallyproduced by a jointed panel production way, that is, a plurality of theintegrated packaging assemblies are produced at one time. Morespecifically, FIGS. 1A and 1B show a way of producing the integratedpackaging assembly by using a molding die to perform jointed panelproduction. Wherein, the molding die includes an upper die 101 and alower die 102, and one of the circuit board jointed panels is placed inthe lower die 102 of the molding die, the circuit board jointed panelincludes a plurality of rows of the circuit boards, each row of thecircuit boards includes a plurality of the circuit boards 2, and each ofthe circuit board 2 is operatively connected to the photosensitive chip3. The upper die 101 and the lower die 102 are clamped to form a moldingcavity, so that the upper die 101 is pressed on the circuit boardjointed panel, and is corresponding to the two end sides of thephotosensitive chip 3 on each row of the circuit boards, and two flowpassages 103 and 104 are formed in the upper die, and the upper die 101has a plurality of the bumps 105, an intermediate flow passage 106 isformed between two adjacent bumps 105, so that the plurality of theintermediate flow passages 106 extend between the two flow passages 103and 104. In the molding process, a fluid-like packaging material 4 flowsforward along with the two flow passages 103 and 104, and fills into theintermediate flow passage 106 between two adjacent bumps 105, so thatthe region between two adjacent photosensitive chips 3 is also filledwith the packaging material 4, thereby after the packaging material 4 iscured, the packaging portion 1 can be formed on the corresponding eachof the circuit boards 2 and each of the photosensitive chips 3, a lightwindow located in the middle of the packaging portion 1 is formed at aposition corresponding to each of the bumps 105, and these packagingportions 1 are integrally molded to form a one-piece structure, as shownin FIG. 1C.

Referring to FIG. 1E, the thermosetting packaging material 4 has acuring time T in the molding process, as time passes, its viscositydecreases to the lowest point, and then gradually rises to the highestpoint to completely cure. Ideally, when the packaging material 4 has alow viscosity, the packaging material 4 is to fill the flow passages103, 104, and 106, while the packaging material 4 still flows forwardwhen the viscosity is large, the friction thereof to a lead 202 betweenthe circuit board 2 and the photosensitive chip 3 is relatively large,which may easily cause deformation and damage of the lead 202.

In the above-mentioned molding process, the packaging material 4 is athermosetting material, and enters the two flow passages 103 and 104after being melted, and is cured under the action of heating conditions.However, in actual production, it has been found that, during themolding process, when the packaging material 4 flows forward along withthe two flow passages 103 and 104, if the widths of the two flowpassages 103 and 104 is small, it may cause problems.

More specifically, because the packaging material 4 is a fluid having apredetermined viscosity, the dimensions of the two flow passages 103 and104 are relatively small, and for example, the flow passage 103 may be anarrow flow passage, the flow rate in the flow passage 103 is relativelysmall, and the friction generated by the inner wall of the flow passage103 on the fluid-like packaging material 4 in it has a relatively largeeffect on flow velocity of the fluid-like packaging material 4, so theflow velocity of the packaging material 4 in the flow passage 103 isrelatively slow. In this way, during the curing time T of the packagingmaterial 4, the packaging material 4 in the flow passage 103 may notflow from the feeding end to the terminal end within the curing time T,so that some certain position of the flow passage 103 cannot be filled,as the region S shown in FIG. 1D, thereby it is impossible to form aone-piece structure of the packaging portion 1 with a series of completeshapes between the upper die 101 and the lower die 102, and at theposition corresponding to the region S, the packaging portion 1 forms agap, so that it is not possible to form an all-around closed lightwindow. In addition, if the width of the flow passage 104 is narrow, acase as shown in FIG. 1D may also appear in the flow passage 104.

In addition, if, for example, the packaging material 4 in the flowpassage 103 flows too slowly forward, when the viscosity is relativelylarge, it still flows forward in the flow passage 103, resulting in thefrictional force on the lead 202 through which the packaging materialflow is large, so that the lead 202 is deflected forward with a largelevel, thereby the lead 202 is easily deformed and damaged, and iseasily detached from a bonding pad.

As shown in FIG. 1F, it is a camera module packaged by using theexisting integrated packaging technology, which includes a packagingportion 1, a circuit board 2, a photosensitive chip 3, a filter 5, and alens assembly 6. In this structure, the packaging portion 1 is packagedin the circuit board 2 and the photosensitive chip 3 by an integratedpackaging way, thereby forming an integrated packaging assembly, and thepackaging portion 1 covers a series of electronic components 201 of thecircuit board 2 and a series of leads 202 electrically connecting thephotosensitive chip 3 and the circuit board 2, which enables the lengthand width dimensions and thickness dimensions of the camera module to bereduced, assembly tolerances to be reduced, and the lens assembly 6positioned above the integrated packaging assembly to be mounted flatly,and the problem that the dust attached to the electronic component 201affects the imaging quality of the camera module to be solved.

In addition, in order to facilitate demolding, an inner surface of thepackaging portion 1 that is generally formed extends integrally andobliquely from the photosensitive chip 3, which will cause the area ofthe top surface of the packaging portion 1 to decrease, and the top sideof the packaging portion 1 needs to be used for mounting an upperoptical device of the camera module, such as the lens assembly 6described above, or additional components, such as lens holders, etc.However, the small-area top surface of the packaging portion 1 may notprovide sufficient mounting surfaces for the upper optical device of thecamera module, so that these upper optical devices are unable to bestably mounted and glue is prone to overflow on the mounting surface.

In the manufacturing process of the integrated assembly shown in FIG.1B, a circuit board 201 to which a photosensitive chip 3 is connected isplaced in a die, and a bump 105 is pressed on the photosensitive chip 3as an indenter. Flow passages 103, 104, and 106 substantially form agroove 107 surrounding the bump 105, and a fluid-like packaging material4 is filled into the groove 107, after the fluid-like packaging material4 being cured, the packaging portion 1 is formed, and a through hole ofthe packaging portion 1 is formed at the position corresponding to thebump 105. The bump 105 has an inclined outer surface 1051, so as to forman integrally extending inner surface of the packaging portion 1.

However, in the integrated packaging process, the fluid-like packagingmaterial may enter between the photosensitive chip 3 and the bottomsurface of the bump 105, thereby causing the packaging material to reacha photosensitive region of the photosensitive chip 3, forming a “flash”,thereby affecting the photosensitive effect of the photosensitive chip3. Furthermore, a filling groove 1071 is formed on the bottom side ofthe groove 107 between the photosensitive chip 3 and the inclined outersurface 1051 of the bump 105, in the integrated packaging process, thepackaging material enters the filling groove 1071, and the inclinedouter surface 1051 of extends obliquely the bump 105 tends to guide thepackaging material into the filling groove 1071, resulting in thefilling groove 1071 having a greater volume, and the fluid-likepackaging material generates a relative large pressure force andintensity of pressure, therefore the probability that the packagingmaterial enters between the photosensitive chip 3 and the bottom surfaceof the bump 105 is increased, so that the packaging material is likelyto pollute the photosensitive region of the photosensitive chip 3,thereby affecting the photosensitive performance of the photosensitivechip 3. Moreover, if in order to reduce the occurrence of “flash”, thepressure force of the bump 105 pressed on the photosensitive chip 3 isincreased, the photosensitive chip 3 may be damaged.

SUMMARY OF THE INVENTION

An object of the present application is to provide a camera module, aphotosensitive assembly thereof and a manufacturing method thereof,wherein in a method for manufacturing a jointed panel of aphotosensitive assembly, a molding material can fill a base jointedpanel molding guide groove in a molding die in a molding process toavoid occurrence of defective products of the photosensitive assembly.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof and a manufacturing method thereof,wherein in a molding process, the molding material can form a one-piecemolding base on a circuit board jointed panel, and the one-piece moldingbase can form an all-round closed light window at positionscorresponding to each photosensitive element, so that after the formedone-piece photosensitive assembly jointed panel is cut, a molding basehaving the light window is formed on each circuit board and thecorresponding photosensitive element to prevent a portion of the moldingbase from forming an opening to connect the light window to the outsideof the molding base.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof, and a manufacturing method thereof,wherein the base jointed panel molding guide groove is used to form theone-piece molding base on a row of the circuit boards, which has twodiversion grooves at two sides, and a plurality of the filling groovesextending laterally between the two diversion grooves, the moldingmaterial flows and cures in the diversion grooves and the fillinggrooves, wherein the side walls of the two diversion grooves aredesigned to increase the volume of the diversion grooves, so that themolding material can flow forward from the feeding ends of the twodiversion grooves and fill the entire the diversion groove and thefilling groove of the base jointed panel molding diversion grooves.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof, and a manufacturing method thereof,wherein the base jointed panel molding guide groove is used to form theone-piece molding base on two adjacent rows of circuit boards with rigidregions integrated, and has two first diversion grooves at two sides, asecond diversion groove in the middle, and a plurality of the fillinggrooves located between the two first diversion grooves and the seconddiversion groove, the molding material flows and cures in the diversiongroove and the filling groove, wherein the side walls of two firstdiversion grooves and the second diversion groove are designed toincrease the volume of the diversion grooves, so that the moldingmaterial can flow forward from the feeding ends of the two diversiongrooves and fill the entire diversion groove and the filling groove ofthe base jointed panel molding guide groove.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof, and a manufacturing method thereof,wherein when the dimension of the diversion groove is small to form aminiaturized photosensitive assembly, by setting the shape of the sidewall of the diversion groove to increase the volume of the diversiongroove, it makes that when the diversion groove with a small dimension,such as the above mentioned first diversion groove, has a width of thebottom end thereof which is less than 1 mm, the entire base jointedpanel molding guide groove is still filled during the molding process.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof, and a manufacturing method thereof,wherein before the viscosity of the molding material reaches a highvalue and the molding material is cured, the molding material can fillthe base jointed panel molding guide groove, thereby preventing theconnecting wire between the circuit board and the photosensitive elementfrom being damaged by a high-viscosity molding material flowing forward.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof, and a manufacturing method thereof,wherein the side walls of the diversion groove is designed to increasethe volume of the diversion grooves, so that the molding material canflow forward from the feeding ends of the respective diversion groovesto the terminal ends thereof, to prevent the molding material in adiversion groove from flowing to another diversion groove to hinder themolding material in the another diversion groove to flow forward.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof and a manufacturing method thereof,wherein the molding process can form the one-piece molding base on a rowof the circuit boards having a plurality of the circuit boards and a rowof the photosensitive elements at a time, so that a row of a pluralityof the photosensitive assemblies are formed by a jointed panel process,such as preferably 2-12 of the photosensitive assemblies.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof and a manufacturing method thereof,wherein the photosensitive assembly includes a molding base integrallymolded on a photosensitive element and a circuit board, wherein in theprocess of forming the molding base by an integrated molding process, amolding material molded to form the molding base cannot easily enterbetween the photosensitive element and the bottom surface of a lightwindow molding portion of a molding die to form a “flash”, therebyreducing the possibility that a photosensitive region of thephotosensitive element is contaminated.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof, and a manufacturing method thereof,wherein by reducing the volume of a filling groove between thephotosensitive element and the outer surface of the light window moldingportion, the pressure force and intensity of pressure generated by themolding material entering the filling groove is reduced, therebyreducing the possibility that the molding material enters between thephotosensitive element and the bottom surface of the light windowmolding portion to form a “flash”.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof and a manufacturing method thereof,wherein an outer surface of the light window molding portion has anouter surface extending in different directions, and an included angleof an outer surface of a top side thereof and the optical axis of thephotosensitive assembly is smaller than that of the outer surface of thebottom side and the optical axis, thereby reducing the volume of thefilling groove formed between the outer surface of the bottom side ofthe light window molding portion and the photosensitive element, therebyreducing the possibility of the occurrence of “flash”.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof, and a manufacturing method thereof,wherein an outer surface of the top side of the optical window moldingportion extends in a direction with a small angle relative to theoptical axis, so that the flow velocity of the molding material enteringthe filling groove is slowed down to a certain extent, and the pressureforce generated by the molding material entering the filling groove isreduced, thereby reducing the possibility of the occurrence of “flash”.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof, and a manufacturing method thereof,wherein the molding material does not easily form a “flash” in theintegrated molding process, so that the light window molding portiondoes not need a greater pressure force to press on the photosensitiveelement, thereby preventing the photosensitive element from beingcrushed.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof, and a manufacturing method thereof,wherein an outer surface of the light window molding portion of themolding die and an optical axis form two angles, wherein the outersurface of the bottom side has a inclination angle, and the outersurface of the bottom side that extends obliquely has a height of 0.05mm or more, to prevent an elastic coating film covering the light windowmolding portion from being easily punctured during the molding process.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof, and a manufacturing method thereof,wherein the molding base has a plurality of the inner surfaces extendingintegrally, and a included angle of the inner surface of the top side ofthe molding base and the optical axis is smaller than that of the innersurface of the bottom side of the molding base and the optical axis,which makes the inner surface of the molding base extend in a twistedmanner, and there is the molding material with a smaller size betweenthe inner surface of the bottom side of the molding base and thephotosensitive element, so that the molding material does not easilyform a “flash” on the photosensitive element.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof, and a manufacturing method thereof,wherein the molding base includes a photosensitive element couplingportion that extend integrally and a top side extending portion, and theinner surfaces thereof have different extension angles, wherein there isa small included angle of the top side extending portion and the opticalaxis, so that the area of the top surface of the top side extendingportion is increased, thereby providing a larger area of the mountingsurface for the lens or the filter element holder or the lens assemblyabove the camera module to stably mount the lens, the filter elementholder, or the lens assembly.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof and a manufacturing method thereof,wherein an inner surface of the photosensitive element coupling portionof the molding base extends obliquely so as to facilitate demoldingoperation and reduce the stray light reaching the photosensitive elementin a molding process, and the inner surface of the top side extendingportion integrally extends in a twisted manner from the inner surface ofthe photosensitive element coupling portion, so that the photosensitiveelement coupling portion and the top side extending portion cooperate tomaximize the area of the top surface of the molding base while reducingthe stray light.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof, and a manufacturing method thereof,wherein an inner surface of the top side extending portion integrallyextends in a twisted manner from the photosensitive element couplingportion to prevent a light window molding part of a molding die frompressing on a connecting wire connecting the photosensitive element andthe circuit board during the molding process, causing damage to theconnecting wire.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof, and a manufacturing method thereof,wherein a smaller included angle of the top side extending portion andan optical axis can reduce an area of the filter element.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof and a manufacturing method thereof,wherein a filter element main body of a filter element of thephotosensitive assembly of the camera module is provided with a lightshielding layer, so that the central region of the filter element mainbody forms an effective light transmission region to reduce the straylight reaching the interior of a molding base.

An object of the present application is to provide a camera module, aphotosensitive assembly thereof, and a manufacturing method thereof,wherein in some embodiments, the light shielding layer is provided on abottom side of the filter element main body to reduce the light incidenton the inner surface of the top side extending portion, therebypreventing the light incident on the inner surface of the top sideextending portion from being reflected and reaching the photosensitiveelement to form the stray light, which affects the imaging quality ofthe camera module.

In order to achieve at least one of the above objects of the invention,the present application provides a method for manufacturing aphotosensitive assembly of a camera module, which includes the followingsteps:

(a) fixing a circuit board jointed panel to a second die of a moldingdie, wherein the circuit board jointed panel includes one or more rowsof the circuit boards, and each row of the circuit boards includes oneor more circuit boards arranged side by side, each of the circuit boardsincludes a rigid region and a flexible region combined with each other,and each of the circuit boards is operatively connected with aphotosensitive element;

(b) clamping the second die and a first die, and filling a moltenmolding material in a base jointed panel molding guide groove in themolding die, wherein a position corresponding to at least one lightwindow molding portion is prevented from filling with the moldingmaterial; and

(c) curing the molding material in the base jointed panel molding guidegroove to form a one-piece molding base at a position corresponding tothe base jointed panel molding guide groove, wherein the one-piecemolding base is integrally molded on corresponding one or more rows ofthe circuit board and one or more rows of the photosensitive elements toform a photosensitive assembly jointed panel and forms a light windowfor providing a light path for each of the photosensitive elements at aposition corresponding to the light window molding portion, wherein thebase jointed panel molding guide groove has a first diversion groovecorresponding to a first end side of the one-piece molding base adjacentto the flexible region and a second diversion groove corresponding tothe one-piece molding base away from the flexible region, and aplurality of the filling grooves extending between the first diversiongroove and the second diversion groove, wherein the first diversiongroove has a first side surface facing the light window, the seconddiversion groove has a second side surface facing the light window,wherein the first side surface includes a first partial surface providedadjacent to the photosensitive element and a second partial surfaceconnected to the first partial surface, and the second side surface hasa third partial surface provided adjacent to the photosensitive elementand a fourth partial surface connected to the third partial surface,wherein a first angle of the first partial surface relative to anoptical axis of the camera module is greater than a second angle of thesecond partial surfaces relative to the optical axis, and a third angleof the third partial surface relative to the optical axis is greaterthan a fourth angle of the fourth partial surface relative to theoptical axis.

The photosensitive assembly jointed panel is used for manufacturing aplurality of the photosensitive assemblies, wherein the method furtherincludes the step of: cutting the photosensitive assembly jointed panelto obtain a plurality of the photosensitive assemblies, wherein each ofthe photosensitive assemblies includes the circuit board, thephotosensitive element, and the molding base, wherein the molding baseis integrally molded on the circuit board and the photosensitive elementand forms the light window that provides a light path for thephotosensitive element.

According to another aspect of the present application, the presentapplication provides a photosensitive assembly of a camera module,including:

a circuit board, including a rigid region and a flexible region combinedwith each other;

a photosensitive element; and

a molding base, wherein the molding base is integrally molded on thecircuit board and the photosensitive element and forms a light windowthat provides a light path for the photosensitive element; wherein afirst end side corresponding to the molding base adjacent to theflexible region has a first side surface facing the light window, andthe first side surface includes a first partial surface providedadjacent to the photosensitive element and a second partial surfaceconnected to the second partial surface, and a first angle of the firstpartial surface relative to an optical axis of the camera module isgreater than a second angle of the second partial surface relative tothe optical axis; the opposite second end side corresponding to themolding base away from the flexible region has a second side surfacefacing the light window, the second side surface includes a thirdpartial surface provided adjacent to the photosensitive element and afourth partial surface connected to the third partial surface, and athird angle of the third partial surface relative to the optical axis isgreater than a fourth angle of the fourth partial surface relative tothe optical axis.

According to another aspect of the present application, the presentapplication also provides a photosensitive assembly jointed panel of acamera module, including:

one or more rows of circuit boards, each row of the circuit boardsincludes one or more circuit boards arranged side by side, each of thecircuit boards includes a rigid region and a flexible region combinedwith each other;

one or more rows of photosensitive elements; and

one or more of one-piece molding bases, each of the one-piece moldingbases is integrally molded on a row of the circuit boards and a row ofthe photosensitive elements and forms a light window that provides alight path for each of the photosensitive elements; wherein the firstend side corresponding to the one-piece molding base adjacent to theflexible region has a first side surface facing the light window, andthe first side surface includes a first partial surface providedadjacent to the photosensitive element and a second partial surfaceconnected to the first partial surface, and a first angle of the firstpartial surface relative to an optical axis of the camera module isgreater than a second angle of the second partial surface relative tothe optical axis; an opposite second end side corresponding to theone-piece molding base away from the flexible region has a second sidesurface facing the light window, and the second side surface includes athird partial surface provided adjacent to the photosensitive elementand a fourth partial surface connected to the third partial surface, anda third angle of the third partial surface relative to the optical axisis greater than a fourth angle of the fourth partial surface relative tothe optical axis.

According to another aspect of the present application, the presentapplication also provides a photosensitive assembly jointed panel of acamera module, including:

multiple rows of the circuit boards, each row of the circuit boardsincluding one or more circuit boards arranged side by side, each of thecircuit boards including a rigid region and a flexible region combinedwith each other;

multiple rows of the photosensitive elements; and

one or more one-piece molding bases, each of the one-piece molding basesis integrally molded on two adjacent rows of the circuit boards and twoadjacent rows of the photosensitive elements and forms a light windowthat provides a light path for each of the photosensitive elements, andthe two adjacent rows of the circuit boards are arranged so that theirflexible regions are away from each other and their rigid regions areadjacent to each other, so that each of the one-piece molding bases hasthe two end sides adjacent to the flexible regions, wherein the firstside surface corresponding to the one-piece molding base adjacent to theflexible region has the first side surface facing the light window, thefirst side surface includes a first partial surface provided adjacent tothe photosensitive element and a second partial surface connected to thefirst partial surface, and a first angle of the first partial surfacerelative to an optical axis of the camera module is greater than asecond angle of the second partial surface relative to the optical axis;a second end side of the one-piece molding base extending between thetwo adjacent rows of the photosensitive elements has a second sidesurface facing the light window, the second side surface includes athird partial surface provided adjacent to the photosensitive elementand a fourth partial surface connected to the third partial surface, anda third angle of the third partial surface relative to the optical axisis greater than a fourth angle of the fourth partial surface relative tothe optical axis.

According to another aspect of the present application, the presentapplication also provides a camera module, including:

a lens;

a circuit board, including a rigid region and a flexible region combinedwith each other;

a photosensitive element; and

a molding base, wherein the molding base is integrally molded on thecircuit board and the photosensitive element and forms a light windowthat provides a light path for the photosensitive element, wherein thelens is located on a photosensitive path of the photosensitive element;wherein the first end side corresponding to the molding base adjacent tothe flexible region has a first side surface facing the light window,and the first side surface includes a first partial surface providedadjacent to the photosensitive element and a second partial surfaceconnected to the first partial surface, and a first angle of the firstpartial surface relative to an optical axis of the camera module isgreater than a second angle of the second partial surface relative tothe optical axis; the opposite second end side corresponding to themolding base away from the flexible region has a second side surfacefacing the light window, the second side surface includes a thirdpartial surface provided adjacent to the photosensitive element and afourth partial surface connected to the third partial surface, and athird angle of the third partial surface relative to the optical axis isgreater than a fourth angle of the fourth partial surface relative tothe optical axis.

According to another aspect of the present application, the presentapplication further provides molding die for manufacturing aphotosensitive assembly jointed panel for a camera module, including afirst die and a second die suitable for being separated from each otherand being in close contact with each other, wherein the first die andthe second die form a molding cavity when they are in close contact witheach other, and the molding die is configured with at least one lightwindow molding portion and a base jointed panel molding guide grooveformed around the light window molding portion in the molding cavity,and the molding cavity is suitable for fixing a circuit board jointedpanel therein, wherein the circuit board jointed panel includes one ormore rows of the circuit boards, each row of the circuit boards includesone or more circuit boards arranged side by side, each of the circuitboards includes a rigid region and flexible region combined with eachother, and each of the circuit boards is operatively connected with aphotosensitive element, the base jointed panel molding guide groove isadapted to be filled with molding material so as to form a one-piecemolding base at a position corresponding to the base jointed panelmolding guide groove, wherein the one-piece molding base is integrallymolded on corresponding each row of the circuit boards and each row ofthe photosensitive elements to form the photosensitive assembly jointedpanel and forms a light window that provides a light path for each ofthe photosensitive elements at a position corresponding to the lightwindow molding portion, wherein the base jointed panel molding guidegroove has a first diversion groove of a first end side of correspondingto the one-piece molding base adjacent to the flexible region and asecond diversion groove corresponding to the one-piece molding base awayfrom the flexible region, and a plurality of the filling groovesextending between the first diversion groove and the second diversiongroove, wherein each of the light window molding portions is locatedbetween the two adjacent filling grooves, wherein the first diversiongroove has a first side surface facing the light window, and the seconddiversion groove has a second surface facing the light window, whereinthe first side surface includes a first partial surface providedadjacent to the photosensitive element and a second partial surfaceconnected to the first partial surface, and the second side surface hasa third partial surface provided adjacent to the photosensitive elementand a fourth partial surface connected to the third partial surface,wherein a first angle of the first partial surface relative to anoptical axis is greater than a second partial surface relative to theoptical axis, a third angle of the third partial surface relative to theoptical axis is greater than a fourth angle of the fourth partialsurface relative to the optical axis.

According to another aspect of the present application, the presentapplication further provides a molding die for manufacturing aphotosensitive assembly jointed panel for a camera module, including afirst die and a second die suitable for being separated from each otherand being in close contact with each other, wherein the first die andthe second die form a molding cavity when they are in close contact witheach other, and the molding die is configured with light window moldingportion and a base jointed panel molding guide groove form ed around thelight window molding portion in the molding cavity, and the moldingcavity is suitable for fixing a circuit board jointed panel therein,wherein the circuit board jointed panel includes multiple rows of thecircuit boards, each row of the circuit boards includes one or morecircuit boards arranged side by side, and each of the circuit boardsincludes a rigid region and a flexible region combined with each other,and each of the circuit boards is operatively connected with aphotosensitive element, wherein the base jointed panel molding guidegroove is adapted to be filled with molding material so as to form aone-piece molding base at a position corresponding to the base jointedpanel molding guide groove, wherein the one-piece molding base isintegrally molded on two adjacent rows of the circuit boards and twoadjacent rows of the photosensitive elements to form the photosensitiveassembly jointed panel and forms a light window that provides a lightpath for each of the photosensitive elements at a position correspondingto the light window molding portion, wherein the two adjacent rows ofthe circuit boards are arranged so that their flexible regions are awayfrom each other and their rigid regions are adjacent to each other,wherein the base jointed panel molding guide groove has two firstdiversion grooves corresponding to two end sides of the one-piecemolding base adjacent to the flexible region, and a second diversiongrooves corresponding to regions between the two adjacent rows of thephotosensitive elements, and a plurality of the filling groovesextending between two of the first diversion grooves and the seconddiversion groove, wherein each of the light window molding portions islocated between the two adjacent filling grooves, wherein the firstdiversion groove has a first side surface facing the light window, andthe second diversion groove has a second side surface facing the lightwindow, wherein the first side surface includes a first partial surfaceprovided adjacent to the photosensitive element and a second partialsurface connected to the first partial surface, the second side surfacehas a third partial surface provided adjacent to the photosensitiveelement and a fourth partial surface connected to the third partialsurface, wherein a first angle of the first partial surface relative toan optical axis of the camera module is greater than a second angle ofthe second partial surface relative to the optical axis, and a thirdangle of the third partial surface relative to the optical axis isgreater than a fourth angle of the fourth partial surface relative tothe optical axis.

The present application also provides a photosensitive assembly,including:

a circuit board;

a photosensitive element, which is operatively connected to the circuitboard; and

a molding base, which is integrally combined with the circuit board andthe photosensitive element and forms a light window, wherein the moldingbase has one or more first portion inner surfaces adjacent to thephotosensitive element and one or more second partial inner surfacesconnected to the first portion inner surface and away from thephotosensitive element, wherein there is an included angle α between thefirst portion inner surface and an optical axis of the photosensitiveassembly, and there is an included angle β between the second portioninner surface and the optical axis of the photosensitive assembly,wherein β<α.

According to another aspect of the present application, the presentapplication further provides a camera module, including

a lens;

a circuit board;

a photosensitive element, which is operatively connected to the circuitboard; wherein the lens is located on a photosensitive path of thephotosensitive element; and

a molding base, which is integrally combined with the circuit board andthe photosensitive element and forms a light window, wherein the moldingbase has a first portion inner surface adjacent to the photosensitiveelement and a second partial inner surface connected to the firstportion inner surface and away from the photosensitive element, whereinthere is an included angle α between the first portion inner surface andan optical axis of the camera module, and there is an included angle βbetween the second portion inner surface and the optical axis of thecamera module, wherein β<α.

According to another aspect of the present application, the presentapplication further provides a molding die for manufacturing at leastone photosensitive assembly applied to a camera module, thephotosensitive assembly includes a circuit board, a photosensitiveelement, and a molding base, wherein the molding base is integrallymolded on the circuit board and the photosensitive element form a lightwindow, wherein the molding die includes a first die and a second diesuitable for being separated from each other and being in close contactwith each other, and at least one light window molding portionconfiguring therein and a base molding guide groove forming around thelight window molding portion, the circuit board to which thephotosensitive element is connected is placed in the molding die, andwhen the first die and the second die are in close contact with eachother, a molten molding material is filled into the base molding guidegroove and cured to form the molding base, the light window is formedcorresponding to the position of the light window molding portion,wherein the light window molding portion has at least one first partialouter surface and at least one second partial outer surface in adirection from the bottom side to the top side, which respectively formangles α and β with the optical axis perpendicular to the photosensitiveelement, and α>β.

According to another aspect of the present application, the presentapplication further provides an electronic device including one or moreof the camera modules described above. The electronic device includes,but are not limited to, a mobile phone, a computer, a television, asmart wearable device, a vehicle, a camera, and a monitoring device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic structural view of a molding die for obtaining aphotosensitive assembly packaged by the existing integrated packagingprocess.

FIG. 1B is a schematic view of a molding process of forming anintegrated packaging assembly by the existing integrated packageprocess.

FIG. 1C is an enlarged structure view illustrating the forward flow ofthe packaging material along with two flow passages in the existingintegrated packaging process.

FIG. 1D is an enlarged structure view illustrating that the packagingmaterial is partially not filled with in the existing integratedpackaging process.

FIG. 1E is a schematic diagram of a viscosity change tendency of amolding material during curing time.

FIG. 1F is a schematic structural view of a camera module made of aphotosensitive assembly packaged by the existing integrated packagingprocess.

FIG. 2 is a schematic block view of a manufacturing equipment of aphotosensitive assembly jointed panel for a camera module according tothe first preferred embodiment of the present application.

FIG. 3A is a schematic structural view of a molding die of themanufacturing equipment for the photosensitive assembly jointed panel ofthe camera module according to the above mentioned first preferredembodiment of the present application.

FIG. 3B is an enlarged structural schematic view of a partial region Aof a first die of the molding die of the manufacturing equipment of thephotosensitive assembly jointed panel of the camera module according tothe above mentioned first preferred embodiment of the presentapplication.

FIG. 4 is a schematic structural view of the photosensitive assemblyjointed panel of the camera module according to the first preferredembodiment of the present application.

FIG. 5A is an enlarged structural schematic view of the photosensitiveassembly of the camera module according to the first preferredembodiment of the present application.

FIG. 5B is an enlarged structural schematic top view of thephotosensitive assembly of the camera module according to the firstpreferred embodiment of the present application.

FIG. 6A is a cross-sectional view of the photosensitive module of thecamera module according to the above mentioned first preferredembodiment of the present application, taken along the line C-C in FIG.5A.

FIG. 6B is a cross-sectional view of a second end side of thephotosensitive module of the camera module according to the abovementioned first preferred embodiment of the present application afterbeing further cut.

FIG. 7A is a cross-sectional view illustrating when a molten moldingmaterial is pushed into a base jointed panel molding guide groove in themolding die of the photosensitive assembly jointed panel according tothe above mentioned first preferred embodiment of the presentapplication, wherein the cross-sectional view is a cross-sectional viewcorresponding to the direction of the A-A line illustrated in FIG. 4 .

FIG. 7B is a partially enlarged schematic view at B in FIG. 7A.

FIG. 8 is a cross-sectional view illustrating when a molten moldingmaterial is filled in a base jointed panel molding guide groove in themolding die of the photosensitive assembly jointed panel according tothe above mentioned first preferred embodiment of the presentapplication, wherein the cross-sectional view is a cross-sectional viewcorresponding to the direction of the A-A line illustrated in FIG. 4 .

FIG. 9 is a cross-sectional view illustrating when a molten moldingmaterial is filled in a base jointed panel molding guide groove in themolding die of the photosensitive assembly jointed panel according tothe above mentioned first preferred embodiment of the presentapplication, wherein the cross-sectional view is a cross-sectional viewcorresponding to the direction of the B-B line illustrated in FIG. 4 .

FIG. 10 is a cross-sectional view of performing a demolding step to forma one-piece molding base in the molding die of the photosensitiveassembly jointed panel according to the above mentioned first preferredembodiment of the present application, wherein the cross-sectional viewis a cross-sectional view corresponding to the direction of the A-A lineillustrated in FIG. 4 .

FIG. 11 is a schematic view illustrating a three-dimensional structureof the camera module according to the above mentioned first preferredembodiment of the present application.

FIG. 12 is a schematic exploded view illustrating the camera moduleaccording to the above mentioned first preferred embodiment of thepresent application.

FIG. 13A is a cross-sectional view illustrating the camera moduleaccording to the above mentioned first preferred embodiment of thepresent application, taken along line D-D in FIG. 12 .

FIG. 13B is a cross-sectional view illustrating the camera moduleaccording to the above mentioned first preferred embodiment of thepresent application, taken along line E-E in FIG. 12 .

FIG. 14 is a cross-sectional view illustrating a variant embodiment ofthe camera module according to the above mentioned first preferredembodiment of the present application.

FIG. 15 is a cross-sectional view illustrating a camera module accordingto another variant embodiment of the camera module of the abovementioned first preferred embodiment of the present application.

FIG. 16 is a cross-sectional view of a camera module according toanother variant embodiment of the camera module of the above mentionedfirst preferred embodiment of the present application.

FIG. 17A is a schematic structural view of a molding die of amanufacturing equipment of a photosensitive assembly jointed panel of acamera module according to a second preferred embodiment of the presentapplication.

FIG. 17B is an enlarged schematic structural view of a partial region Cof a first die of the molding die of the manufacturing equipment of thephotosensitive assembly jointed panel of the camera module according tothe above mentioned second preferred embodiment of the presentapplication.

FIG. 18 is a schematic structural view of the photosensitive assemblyjointed panel of the camera module according to the above mentionedsecond preferred embodiment of the present application.

FIG. 19A is an enlarged structural schematic view at D of thephotosensitive assembly jointed panel of the camera module according tothe above mentioned second preferred embodiment of the presentapplication.

FIG. 19B is an enlarged structural schematic top view of two adjacentphotosensitive assemblies of the photosensitive assembly jointed panelof the camera module according to the above mentioned second preferredembodiment of the present application.

FIG. 20A is a cross-sectional view of the photosensitive assemblyjointed panel of the camera module according to the above mentionedsecond preferred embodiment of the present application, taken along lineH-H in FIG. 19A.

FIG. 20B is a schematic structural view of two photosensitive assembliesobtained by cutting the photosensitive assembly jointed panel of thecamera module according to the above mentioned second preferredembodiment of the present application.

FIG. 21A is a cross-sectional view illustrating when a molten moldingmaterial is pushed into a base jointed panel molding guide groove in themolding die of the photosensitive assembly jointed panel according tothe above mentioned second preferred embodiment of the presentapplication, wherein the cross-sectional view is a cross-sectional viewcorresponding to the direction of the F-F line illustrated in FIG. 18 .

FIG. 21B is a partially enlarged schematic view at E in FIG. 21A.

FIG. 22 is a cross-sectional view illustrating when a molten moldingmaterial is filled in a base jointed panel molding guide groove in themolding die of the photosensitive assembly jointed panel according tothe above mentioned second preferred embodiment of the presentapplication, wherein the cross-sectional view is a cross-sectional viewcorresponding to the direction of the F-F line illustrated in FIG. 18 .

FIG. 23 is a cross-sectional view illustrating when a molten moldingmaterial is filled in a base jointed panel molding guide groove in themolding die of the photosensitive assembly jointed panel according tothe above mentioned second preferred embodiment of the presentapplication, wherein the cross-sectional view is a cross-sectional viewcorresponding to the direction of the G-G line illustrated in FIG. 18 .

FIG. 24 is a cross-sectional view of performing a demolding step to forma one-piece molding base in the molding die of the photosensitiveassembly jointed panel according to the above mentioned first preferredembodiment of the present application, wherein the cross-sectional viewis a cross-sectional view corresponding to the direction of the F-F lineillustrated in FIG. 18 .

FIG. 25A to 25C are schematic cross-sectional views of a photosensitiveassembly jointed panel according to a variant embodiment of the abovementioned first and second preferred embodiments of the presentapplication, and enlarged structural views of the photosensitiveassembly obtained by cutting the photosensitive assembly jointed panel.

FIG. 26A is a schematic structural view illustrating a photosensitiveassembly jointed panel according to another variant embodiment of theabove mentioned second preferred embodiment of the present application.

FIG. 26B is a schematic enlarged structure view of a photosensitiveassembly according to another variant embodiment of the above mentionedsecond preferred embodiment of the present application.

FIG. 27 is a cross-sectional view illustrating the photosensitiveassembly according to the another variant embodiment of the abovementioned second preferred embodiment of the present application, takenalong the line I-I in FIG. 26B.

FIG. 28 is a three-dimensional exploded view of a camera moduleaccording to a third preferred embodiment of the present application.

FIG. 29A is a schematic structural diagram of a camera module accordingto a third preferred embodiment of the present application.

FIG. 29B is an enlarged structural schematic diagram at J in FIG. 29A.

FIG. 30 is a schematic view illustrating that a light shielding layer isattached to a bottom side of the photosensitive assembly of the cameramodule according to the above-mentioned third preferred embodiment ofthe present application to effectively reduce stray light reflected tothe photosensitive element.

FIG. 31A is a cross-sectional view illustrating when a molten moldingmaterial is pushed into a base molding guide groove in a molding die ina molding process according to the above-mentioned third preferredembodiment of the present application.

FIG. 31B is a cross-sectional view illustrating when the molten moldingmaterial is filled in the base molding guide groove in the thirdpreferred embodiment of the present application.

FIG. 31C is a cross-sectional view illustrating the formation of amolding base by performing a demolding step according to theabove-mentioned third preferred embodiment of the present application.

FIG. 32A is a schematic view illustrating that a light shielding layeris attached to both sides of a photosensitive assembly according to avariant embodiment of the third preferred embodiment of the presentapplication to effectively reduce stray light.

FIG. 32B is a cross-sectional view illustrating a camera moduleaccording to another variant embodiment of the third preferredembodiment of the present application.

FIG. 33 is a cross-sectional view illustrating a camera module accordingto another variant embodiment of the third preferred embodiment of thepresent application.

FIG. 34 is a cross-sectional view illustrating a camera module accordingto another variant embodiment of the third preferred embodiment of thepresent application.

FIG. 35 is a three-dimensional exploded view illustrating a cameramodule according to a fourth preferred embodiment of the presentapplication.

FIG. 36A is a cross-sectional view of the camera module according to theabove-mentioned fourth preferred embodiment of the present application,taken along the line K-K in FIG. 35 .

FIG. 36B is an enlarged schematic view at L in FIG. 36A.

FIG. 37 is a schematic view illustrating that a light shielding layer isattached to a bottom side of the photosensitive assembly of the cameramodule according to the above-mentioned fourth preferred embodiment ofthe present application to effectively reduce stray light reflected tothe photosensitive element.

FIG. 38 is a cross-sectional view of a camera module according to avariant embodiment of the above-mentioned fourth preferred embodiment ofthe present application.

FIG. 39 is a three-dimensional exploded view of a camera moduleaccording to a fifth preferred embodiment of the present application.

FIG. 40 is a cross-sectional view of the camera module according to theabove-mentioned fifth preferred embodiment of the present application,taken along the line M-M in FIG. 39 .

FIG. 41 is a schematic view illustrating that a light shielding layer isattached to a bottom side of the photosensitive assembly of the cameramodule according to the above-mentioned fifth preferred embodiment ofthe present application to effectively reduce stray light reflected tothe photosensitive element.

FIG. 42 is a cross-sectional view illustrating a camera module accordingto a variant embodiment of the above-mentioned fifth preferredembodiment of the present application.

FIG. 43 is a cross-sectional view illustrating a camera module accordingto another variant embodiment of the above-mentioned fifth preferredembodiment of the present application.

FIG. 44 is a schematic structural diagram of the application of theabove camera module according to the present application to intelligentelectronic device.

DETAIL DESCRIPTION OF THE INVENTION

The following description is used to disclose the present application sothat those skilled in the art can implement the present application. Thepreferred embodiments in the following description are merelyembodiments, and those skilled in the art can think of other obviousvariations. The basic principles of the present application defined inthe following description can be applied to other embodiments,modifications, improvements, equivalents, and other technical solutionswithout departing from the spirit and scope of the present application.

Those skilled in the art should understand that, in the disclosure ofthe present application, The orientation or positional relationship ofthe indications of the terms “longitudinal”, “transverse”, “upper”,“lower”, “front”, “back”, “left”, “right”, “upright”, “horizontal”,“top”, “bottom”, “inside”, “outside”, etc. is based on the orientationor positional relationship shown in the drawings, which is merely forthe convenience of describing the present application and simplifyingthe description rather than indicating or implying that the device orcomponent referred to must have a particular orientation, or beconstructed and operated in a particular orientation. Therefore, theabove terms are not to be construed as limiting the present application.

It can be understood that the term “a” should be understood as “at leastone” or “one or more”, that is, in one embodiment, the number of onecomponent can be one, while in other embodiments, the number of thecomponent may be plural, and the term “a” cannot be understood as alimitation on the number. As shown in FIGS. 2 to 14 , a camera module100 and a photosensitive assembly 10 and a manufacturing method thereofaccording to a first preferred embodiment of the present application areshown. The camera module 100 can be applied to various electronicdevices 300. The electronic device 300 includes a device main body 301and one or more camera modules 100 mounted in the device main body 301,as shown in FIG. 44 . The electronic device 30 is exemplified but notlimited to a smart phone, a wearable device, a computer device, atelevision, a vehicle, a camera, a monitoring device, etc., and thecamera module cooperates with the electronic device to implement imageacquisition and reproduction of the target object.

More specifically, the figures illustrate a photosensitive assembly 10of the camera module 100 and its manufacturing equipment 200. Thephotosensitive assembly 10 includes a circuit board 11, a molding base12 and a photosensitive element 13. The molding base 12 is integrallymolded on the circuit board 11 and the photosensitive element 13 andform a light window 122 that provides a light path for thephotosensitive element 13. Wherein, the molding base 12 of the presentapplication is integrally molded on the circuit board 11 and thephotosensitive element 13 by the manufacturing equipment 200 through amolding process, more specifically, a transfer molding process, so thatthe molding base 12 can replace the lens holder or the bracket of theconventional camera module, and does not need to attach the lens holderor the bracket to the circuit board 11 by glue in a conventionalpackaging process. Further, referring to FIGS. 2-4 and 7A to 10 , thepresent application manufactures a photosensitive assembly jointed panel1000 through the manufacturing equipment 200, that is, thephotosensitive assembly jointed panel 1000 having a plurality ofphotosensitive assemblies 10 is manufactured by a jointed panel process.The photosensitive assembly jointed panel 1000 includes a circuit board1100 and one or more one-piece molding bases 1200. The circuit boardjointed panel 1100 includes a plurality of rows of the circuit boards,such as four-row circuit boards illustrated in FIG. 4 , and each row ofthe circuit boards includes a plurality of circuit boards 11, such as2-12 circuit boards 11, for example, six circuit boards shown in FIG. 11, and each of the circuit boards 11 is operatively connected to aphotosensitive element 13. Each of the one-piece molding bases 1200 isformed on a row of the circuit boards and is integrally molded on atleast a part of non-photosensitive region 132 of each of thephotosensitive elements 13 of the row of the photosensitive elements 13to expose a photosensitive region 131 of the photosensitive element 13.Each of the one-piece molding bases 1200 has a plurality of lightwindows 122, and the positions of each light window 122 correspond toeach of the photosensitive elements 13 for providing a light path forthe corresponding photosensitive elements 13.

Wherein, the manufacturing equipment 200 of the photosensitive assemblyjointed panel 1000 of the camera module 100 includes a molding die 210,a molding material feeding mechanism 220, a die fixing device 230, atemperature control device 250, and a controller 260, the moldingmaterial feeding mechanism 220 is used to provide a molding material 14to a base jointed panel molding guide groove 215. The die fixing device230 is used to control the die opening and clamping of the molding die210, the temperature control device 250 is used to heat thethermosetting molding material 14, and the controller 260 is used toautomatically control the operation of the molding material feedingmechanism 220, the die fixing device 230, and the temperature controldevice 250 in the molding process.

The molding die 210 includes a first die 211 and a second die 212 thatcan be opened and clamped under the operation of the die fixing device230, that is, the die fixing device 230 can operate the first die 211and the second die 212 to be separated and closely contacted to form amolding cavity 213. During die clamping, the circuit board jointed panel1100 is fixed in the molding cavity 213, and the fluid-like moldingmaterial 14 enters the molding cavity 213 and is integrally molded oneach row of the circuit boards 11 and the corresponding each row of thephotosensitive elements 13, and after be cured, it forms the one-piecemolding base 1200 integrally molded on each row of the circuit boards 11and each row of the photosensitive elements 13.

More specifically, the molding die 210 further has one or more basejointed panel molding guide grooves 215 and a plurality of light windowmolding portions 214 located in the base jointed panel molding guidegrooves 215. When the first and second dies 211 and 212 are clamped, thelight window molding portion 214 and the base jointed panel moldingguide groove 215 extend in the molding cavity 213, and the fluid-likemolding material 14 is filled into the base jointed panel molding guidegroove 215, and the position corresponding to the light window moldingportion 214 cannot be filled with the fluid-like molding material 14,therefore, at a position corresponding to the base jointed panel moldingguide groove 215, the fluid-like molding material 14 can be formed intothe one-piece molding base 1200 after be cured, the one-piece moldingbase 1200 includes a ring-shaped molding main body 121 corresponding tothe molding base 12 of each of the photosensitive assemblies 10, and thelight window 122 of the molding base 12 will be formed at a positioncorresponding to the light window molding portion 214. The moldingmaterial 14 may be selected from, but not limited to, nylon, LCP (LiquidCrystal Polymer), PP (Polypropylene), epoxy resin, and the like.

The first die 211 and the second die 212 may be two dies capable ofmoving relative to each other, such as one of the two dies is fixed andthe other is movable; or both dies are movable. The present applicationis not limited in this aspect. In the example of the embodiment of thepresent application, the first die 211 is specifically implemented as afixed upper die, and the second die 212 is implemented as a movablelower die. The fixed upper die and the movable lower die are arrangedcoaxially, for example, the movable lower die can slide up along with aplurality of positioning axes, and can form the tightly closed moldingcavity 213 as being clamped with the fixed upper die.

The second die 212, that is, the lower die may have a circuit boardpositioning groove 2121, which may be in the shape of a groove or formedby a positioning post for mounting and fixing the circuit board 11, andthe light window molding portion 214 and the base jointed panel moldingguide groove 215 may be formed in the first die 211, that is, formed inthe upper die, and when the first die 211 and the second die 212 areclamped, the molding cavity 213 is formed. In addition, the fluid-likemolding material 14 is injected into the base jointed panel moldingguide grooves 215 on the top side of the circuit board jointed panel1100, so that the one-piece molding base 1200 is formed on the top sideof each row of the circuit boards 11 and each row of the photosensitiveelements 13.

It can be understood that the circuit board positioning groove 2121 mayalso be provided in the first die 211, that is, the upper die, formounting and fixing the circuit board jointed panel 1100, and the lightwindow molding portion 214 and the base jointed panel molding guidegroove 215 may be formed in the second die 211, and when the first die211 and the second die 212 are clamped, the molding cavity 213 isformed. The circuit board jointed panel 1100 may be arranged face upwardin the upper die, and the fluid-like molding material 14 is injectedinto the base jointed panel molding guide groove 215 on the bottom sideof the circuit board jointed panel 1100 that is inverted, so that theone-piece molding base 1200 is formed on the bottom side of the circuitboard jointed panel 1100 that is inverted. More specifically, when thefirst die 211 and the second die 212 are clamped and a molding step isperformed, the light window molding portion 214 is superimposed on thetop surface of the photosensitive element 13 and closely adhered, sothat the fluid-like molding material 14 is prevented from entering thephotosensitive region 1311 on the top surface 131 of the photosensitiveelement 13 on the circuit board 11, so that the light window 122 of theone-piece molding base 1200 can be finally formed at a positioncorresponding to the light window molding portion 214. It can beunderstood that the light window molding portion 214 may be a solidstructure or a structure having a groove shape inside as shown in thefigures.

It can be understood that the molding surface of the first die 211forming the base jointed panel molding guide groove 215 can beconfigured as a flat surface and is on same plane. In this way, when themolding base 12 is cured and molded, the top surface of the molding base12 is relatively flat, so as to provide flat mounting conditions foroptical components such as drivers, lenses, and fixed lens barrels abovethe photosensitive assembly 10 of the camera module 100 to reduce thetilt error of the camera module 100 after assembly.

It is worth mentioning that the base jointed panel molding guide groove215 and the light window molding portion 214 can be integrally molded inthe first die 211. Alternatively, the first die 211 further includes adetachable molding structure, and the molding structure is formed withthe base jointed panel molding guide groove 215 and the light windowmolding portion 214. In this way, according to the shape and dimensionrequirements of the photosensitive assembly 10 such as the diameter andthickness of the molding base, the base jointed panel molding guidegrooves 215 and the light window molding portion 214 of different shapesand dimensions can be designed. In this way, only the different moldingstructures need to be replaced, then the manufacturing equipment can beadapted to be applied to the photosensitive assembly 10 with differentspecifications. It can be understood that the second die 212 may alsoinclude accordingly a detachable fixing block to provide the grooves2121 with different shapes and dimensions, so as to facilitate thereplacement of the circuit board 11 adapted to different shapes anddimensions.

It can be understood that the molding material 14 is a thermosettingmaterial. The molding material 14 is changed into a fluid state byheating and melting the thermosetting material in a solid state. Duringthe molding process, the thermosetting molding material 14 is curedthrough a further heating process, and can no longer be melted after becured, thereby forming the one-piece molding base 1200.

It can be understood that, in the molding process of the presentapplication, the molding material 14 may be a block shape, a granularshape, or a powder shape, which is changed to fluid in the molding die210 after being heated, then is cured to form the one-piece molding base1200.

More specifically, each of the base jointed panel molding diversiongrooves 215 of the present application has a first diversion groove 2151and a second diversion groove 2152 that are substantially parallel toeach other, and a plurality of filling grooves 2153 extends between thefirst diversion groove 2151 and the second diversion grooves 2152,wherein the filling grooves 2153 are formed between two adjacent lightwindow molding portions 214, and as shown in the figure, the basejointed panel molding guide groove 215 has seven filling grooves 2153,and six light window molding portions 214 are located between twoadjacent filling grooves 2153. The molding material 14 flows along withthe first diversion groove 2151 and the second diversion groove 2152from the feeding end 215A to the terminal end 215B, and the moldingmaterial 14 can fill each of the filling grooves 2153, so that theone-piece molding base 1200 is formed after the molding material 14 iscured.

As shown in FIGS. 7A to 10 , it is a schematic view of a manufacturingprocess of the photosensitive assembly jointed panel 1000 of the cameramodule 100 according to this preferred embodiment of the presentapplication. As shown in FIG. 7A, the molding die 210 is in a dieclamping state, the circuit board jointed panel 1100 to be molded andthe solid molding material 14 are ready to be in place, the solidmolding material 14 is heated, thereby when the molding material 14 ismelted into a fluid state or a semi-solid and semi-fluid state, it issent to the base jointed panel molding guide groove 215, flows forwardalong with the first diversion groove 2151 and the second diversiongroove 2152, and fills the filling groove 2153 between two adjacentlight window molding portions 214.

As shown in FIGS. 8 and 9 , when the base jointed panel molding guidegroove 215 is completely filled with the fluid-like molding material 14,the fluid-like molding material 14 is cured and molded into theone-piece molding base 1200 integrally molded on each row of the circuitboards 11 and each row of the photosensitive elements 13 through acuring process.

As shown in FIG. 10 , after the molding material 14 is cured to form theone-piece molding base 1200, a demolding process of the presentapplication is performed, that is, the die fixing device 230 makes thefirst die 211 and the second die 212 to be away from each other, so thatthe light window molding portion 214 is separated from the one-piecemolding base 1200, thereby the light window 122 corresponding to each ofthe photosensitive elements 13 is formed in the one-piece molding base1200.

As shown in FIGS. 4 to 6 , the prepared photosensitive assembly jointedpanel 1000 can be further cut to obtain an individual photosensitiveassembly 10. Each of the photosensitive assemblies 10 includes at leastone circuit board 11, at least one photosensitive element 13 and themolding base 12 integrally molded on the circuit board 11 and thephotosensitive element 13. Each of the circuit boards 11 includes arigid region 111 and a flexible region 112 combined with each other.That is, each of the circuit boards 11 can be implemented as arigid-flex combined board in this embodiment of the present application.Wherein, the molding base 12 is integrally molded on the rigid region111 of the circuit board 11 and at least a part of thenon-photosensitive region 132 of the photosensitive element 13, andforms the light window 122 that provides a light path for thephotosensitive region 131 of the photosensitive element 13.

It is worth mentioning that the manufacturing method of thephotosensitive assembly jointed panel 1000 of the present application issuitable for manufacturing the photosensitive assembly 10 with a smallsize. Therefore, in the molding process, the volumes of the firstdiversion groove 2151 and the second diversion groove 2152 are relativesmall. As can be seen from FIGS. 7A to 10 , the cross sections of thefirst diversion groove 2151 and the second diversion groove 2152 aresubstantially trapezoidal. Wherein, the widths of the bottom ends of thefirst diversion grooves 2151 and the second diversion grooves 2152 arelimited in size and cannot be widened.

Therefore, according to the embodiment of the present application, aninner surface of the one-piece molding base 1200 facing the light window122, that is, a first side surface 1201 of the first diversion groove2151 and a second side surface 1202 of the second diversion groove 2152are provided as a two-end structure.

Specifically, as shown in FIGS. 6A and 6B, the first side surface 1201includes a first partial surface 1203 provided adjacent to thephotosensitive element 13 and a second partial surface 1204 connected tothe first partial surface, and a first angle of the first partialsurface 1203 relative to an optical axis of the camera module is greaterthan a second angle of the second partial surface 1204 relative to theoptical axis. That is, from the perspective of FIGS. 6A and 6B, thefirst partial surface 1203 and the second partial surface 1204 extendfrom bottom to top, and the inclination of the first partial surface1203 is greater than that of the second partial surface 1204. In thisway, because the second partial surface 1204 is inclined toward thelight window direction with respect to the first partial surface 1203,the cross-sectional area of the first diversion groove 2151 isincreased, thereby further increasing the volume of the first diversiongroove 2151.

Similarly, the second side surface 1202 includes a third partial surface1205 provided adjacent to the photosensitive element 13 and a fourthpartial surface 1206 connected to the third partial surface, and a thirdangle of the third partial surface 1205 relative to the optical axis ofthe camera module is greater than a fourth angle of the fourth surfaceportion 1206 relative to the optical axis. That is, from the perspectiveof FIGS. 6A and 6B, the third partial surface 1205 and the fourthpartial surface 1206 extend from bottom to top, and the inclination ofthe third partial surface 1205 is greater than that of the fourthpartial surface 1206. In this way, because the fourth partial surface1206 is inclined toward the light window direction with respect to thethird partial surface 1205, the cross-sectional area of the seconddiversion groove 2152 is increased, thereby further increasing thevolume of the second diversion groove 2152.

Preferably, in the embodiment of the present application, thecross-sectional design of the first diversion groove 2151 and the seconddiversion groove 2152 has symmetry, that is, the first angle of thefirst partial surface 1203 is equal to the third angle of the thirdpartial surface 1205, the second angle of the second partial surface1204 is equal to the fourth angle of the fourth partial surface 1206.Considering the influence of the stray light of the camera module, thefirst angle and the third angle are set to 3°˜80°. In addition,considering other factors of the module process and the structure andmaterial characteristics of the molding base of the camera module, thesecond angle and the fourth angle are set to 0°˜20°.

Here, it should be noted that the second angle and the fourth angle inthe embodiment of the present application are further preferably set to0 degrees, that is, the second partial surface 1204 and the fourthpartial surface 1206 extend perpendicular to the surface of thephotosensitive element 13 upwardly. On one hand, it can maximize thecross-sectional region of the diversion groove, on the other hand, itwill not affect the light incident on the photosensitive chip of thecamera module.

Those skilled in the art can understand that, on one hand, thecross-sectional shape of the diversion groove will affect the flow ofthe molding material, on the other hand, it also directly determines thecross-sectional shape of the resulting molding base.

By the two-stage design of the first side surface 1201 and the secondside surface 1202, that is, by the smaller inclination of the secondpartial surface 1204 relative to the first partial surface 1203, and thesmaller inclination of the fourth partial surface 1206 relative to thethird partial surface 1205, it can further increase the area of theupper surface of the molding base, so that it is convenient to supportother components of the camera module such as a lens holder.

Therefore, in the embodiment of the present application, in addition toconsidering the influence of specific shape and size factors on thecross-sectional shape of the diversion groove, the influence of theshape and size factors on the shape of the molding base needs to befurther considered.

Specifically, since the molding base needs to cover a connecting wire15, the heights of the first side surface 1201 and the second sidesurface 1202 in a direction perpendicular to the surface of thephotosensitive element 13 need to be further defined.

Preferably, in the embodiment of the present application, a first heightof the first partial surface 1203 in a direction perpendicular to thesurface of the photosensitive element 13 and a third height of the thirdpartial surface 1205 in the direction are 0.05 mm˜0.7 mm. In this way,it can be ensured that the formed molding base can cover the connectingwire 15 well. In addition, considering the molding base as a whole tocover the connecting wire 15 and structural factors that furthersupports the lens holder, a second height of the second partial surface1204 in a direction perpendicular to the surface of the photosensitiveelement 13 and a fourth height of the fourth partial surface 1206 in thedirection are 0.02 mm˜0.6 mm.

Through the second partial surface 1204 and the fourth partial surface1206, the height of the molding base can be further increased, whichavoids pressing the connecting wire 15 when installing other componentsof the camera module, such as the lens holder, thereby affecting theperformance of the camera module.

In this way, by setting the side surface of the diversion groove to atwo-stage shape, a smooth flow of the molding material as a fluid in thediversion groove can be ensured. Specifically, the fluid-like moldingmaterial 14 can flow forward along the first diversion groove 2151 andthe second diversion groove 2152 and the entire base jointed panelmolding guide groove 215 is filled with the molding material 14 beforethe molding material 14 is cured.

Accordingly, the molding process of the present application obtains thephotosensitive assembly jointed panel 1000, including: one or more rowsof the circuit board 11, one or more rows of the photosensitive elements13, and one or more one-piece molding bases 1200. Each row of thecircuit boards 11 includes one or more circuit boards 11 arranged sideby side, each of the circuit boards 11 includes the rigid region 111 andthe flexible region 112 combined with each other. Each of the one-piecemolding bases 1200 is integrally molded on a row of the circuit boards11 and a row of the photosensitive elements 13 and forms the lightwindows 122 that provide a light path for each of the photosensitiveelements 13. Wherein, a portion 1200A of the one-piece molding basecorresponding to a first end side of the one-piece molding base 1200adjacent to the flexible region 112 has a first side surface 1201, thefirst side surface 1201 includes a first partial surface 1203 providedadjacent to the photosensitive element 13 and a second partial surface1204 connected to the first partial surface, and a first angle of thefirst partial surface 1203 relative to an optical axis of the cameramodule is greater than a second angle of the second partial surface 1204relative to the optical axis. A portion 1200B of the one-piece moldingbase corresponding to an opposite second end side of the one-piecemolding base 1200 away from the flexible region 112 has a second sidesurface 1202, the second side surface 1202 includes a third partialsurface 1205 provided adjacent to the photosensitive element 13 and afourth partial surface 1206 connected to the third partial surface, anda third angle of the third surface 1205 relative to the optical axis ofthe camera module is greater than a fourth angle of the fourth surface1206 relative to the optical axis. Wherein, the first end side of theone-piece molding base 1200 corresponds to a combined side of the rigidregion 111 and the flexible region 112 of the circuit board 11, that is,the proximal side near the flexible region 112; and the second end sideof the one-piece molding base 1200 corresponds to the distal side of thecircuit board 11 away from the flexible region 112.

A single photosensitive assembly 10 can be obtained after thephotosensitive assembly jointed panel 1000 is cut, wherein, in thecutting step, it can be cut on the two wing sides of the one-piecemolding base 1200 except for the first end side and the second end sideto obtain the molding base 12, and the portion 1200B of the molding basecorresponding to the second end side is not cut, so that thephotosensitive assembly 10 having a portion 1200C of the one-piecemolding base on a pair of opposite wing sides is obtained.

As shown in FIG. 6A, correspondingly, the photosensitive assembly 10includes the circuit board 11, the photosensitive element 13 and themolding base 12. The circuit board 11 includes the rigid region 111 andthe flexible region 112 combined with each other. The molding base 12 isintegrally molded on the circuit board 11 and the photosensitive element13 and forms the light window 122 that provides a light path for thephotosensitive element 13. The circuit board 11 and the photosensitiveelement 13 are connected through a series of connecting wires 15. Aportion 12A of the molding base corresponding to the first end side ofthe molding base 12 adjacent to the flexible region 112 has a first sidesurface 1201, the first side surface 1201 includes the first partialsurface 1203 provided adjacent to the photosensitive element 13 and thesecond partial surface 1204 connected to the first partial surface, anda first angle of the first partial surface 1203 relative to the opticalaxis of the camera module is greater than a second angle of the secondpartial surface 1204 relative to the optical axis. A portion 12B of themolding base corresponding to the opposite second end side of themolding base 12 away from the flexible region 112 has a second sidesurface 1202, the second side surface 1202 includes the third partialsurface 1205 provided adjacent to the photosensitive element 13 and thefourth partial surface 1206 connected to the third partial surface, anda third angle of the third partial surface 1205 relative to the opticalaxis of the camera module is greater than a fourth angle of the fourthsurface portion 1206 relative to the optical axis.

As shown in FIG. 6B, accordingly, in order to further reduce the size ofthe photosensitive assembly 10, at least a part of the photosensitiveassembly 10 on the opposite second end side of the molding base 12 awayfrom the flexible region 112 is suitable for being removed, such ascutting with a knife, or grinding. Here, those skilled in the art canunderstand that the arrangement of the side surfaces is the same as thatshown in FIG. 6A, and will not be repeated here.

By smooth flow of the molding material 14 in the diversion groove, inthe molding process, the molding material 14 can form the one-piecemolding base 1200 on the circuit board jointed panel 1100, and theone-piece molding base 1200 can form the light window 122 closed allaround at the position corresponding to each of the photosensitiveelements 13, so that after cutting the formed one-piece photosensitiveassembly jointed panel 1200, the molding base 12 having the light window122 is formed on each of the circuit boards 11 and the correspondingphotosensitive elements 13 to prevent a part of the molding base fromforming an opening similar to that shown in FIG. 1C to communicate thelight window 122 to the outside of the molding base 12.

That is, the molding material 14 of the present application can flowforward from the feeding ends 215A of the two diversion grooves 2151 and2152 and fill the diversion grooves 2151 and 2152 and the filling groove2153 of the entire base jointed panel molding guide groove 215. Themolding material 14 can flow from the feed end 215A to the terminal end215B along the two diversion grooves 2151 and 2152 before being cured.And before the viscosity of the molding material 14 reaches a high valueand is cured, the molding material 14 can fill the base jointed panelmolding guide groove 215, thereby preventing the connecting wire 15between the circuit board 11 and the photosensitive elements 13 frombeing damaged by the molding material 14 having a high viscosity andflowing forward. In addition, through the symmetrical design of the twodiversion grooves 2151 and 2152, the fluid in the two diversion grooves2151 and 2152 flows substantially at the same step, and the two fluidsare converged substantially in the filling groove 2153 to prevent themolding material 14 in a certain diversion groove from flowing toanother diversion groove to hinder the molding material 14 in theanother diversion groove from flowing forward. Moreover, no turbulenceor sinuous flow is generated, the turbulence or sinuous flow wouldcauses the connecting wires 15 connecting the circuit board 11 and thephotosensitive element 13 to swing irregularly, resulting in deformationand damage.

Accordingly, the molding material 14 of the present application can alsobe selected from a material with a relatively high viscosity range,thereby avoiding that when a material with a small viscosity range isselected, the molding material 14 easily enters into the photosensitiveregion 131 of the photosensitive element 13 to form a flash in themolding process.

In addition, it is worth mentioning that, as shown in FIG. 7B, in orderto facilitate demolding and pressing on the rigid region 111 of thecircuit board 11, the first die 211 further includes a plurality ofpressing blocks 216. An outer edge 1201 of the molding base 12 and anouter edge of the rigid region 111 of the circuit board 11 will form acrimping edge 1111, that is, in the mold process, a region suitable forthe pressing block 216 to be pressed onto the rigid region 111 of thecircuit board 11. The pressing block 216 is further pressed over theflexible region 112 of each row of the circuit boards 11 to prevent themolding material 14 from flowing to the flexible region 112. Inaddition, the rigid regions 111 of each row of the circuit boards 11 areintegrally molded to form an integrated rigid region jointed panel 110,thereby facilitating the pressing of the first die to each row of thecircuit boards 11. As shown in FIG. 7A, on the side adjacent to theflexible region 112, a width W of a bottom end of the first diversiongroove 2151 is 0.2 mm to 1 mm, which is suitable for manufacturing thephotosensitive assembly 10 with a small size. Accordingly, the resultingphotosensitive assembly 10 has a distance W between an inner edge and aouter edge of the portion 12A of the molding base on a side adjacent tothe flexible region 112 of 0.2 mm to 1 mm.

Accordingly, the present application provides a method for manufacturingthe photosensitive assembly 12 of the camera module 100, which includesthe following steps:

fixing the circuit board jointed panel 1100 to the second die 212 of themolding die 210, wherein the circuit board jointed panel 1100 includesone or more rows of the circuit boards, and each row of the circuitboards includes one or more circuit board 11 arranged side by side, eachof the circuit boards 11 includes a rigid region 111 and a flexibleregion 112 combined with each other, and each of the circuit boards 11is operatively connected to the photosensitive element 13;

clamping the second die 212 and a first die 211 by the die fixing device213, and filling a molten molding material 14 in a base jointed panelmolding guide groove 215 in the molding die 210, wherein a positioncorresponding to the light window molding portion 214 is prevented frombeing filled with the molding material 14;

curing the molding material 14 in the base jointed panel molding guidegroove 215 to form the one-piece molding base 1200 at a positioncorresponding to the base jointed panel molding guide groove 215,wherein the one-piece molding base 1200 is integrally molded oncorresponding each row of the circuit board 11 and each row of thephotosensitive elements 13 to form a photosensitive assembly jointedpanel 1000 and forms a light window 122 that provides a light path foreach of the photosensitive elements 13 at a position corresponding tothe light window molding portion 214, wherein the base jointed panelmolding guide groove 215 has a first diversion groove 2151 correspondingto a first end side of the one-piece molding base 1200 adjacent to theflexible region 112 and a second diversion groove 2152 corresponding tothe one-piece molding base 1200 away from the flexible region 112, and afilling groove 2153 extending between the first diversion groove 2151and the second diversion groove 2152 for filling the molding material 14between the two adjacent photosensitive elements 13 in each row of thephotosensitive elements 13 and between the two adjacent light windowmolding portions 214, wherein the first diversion groove 2151 has afirst side surface 1201 facing the light window, the second diversiongroove 2152 has a second side surface 1202 facing the light window,wherein the first side surface 1201 includes a first partial surface1203 provided adjacent to the photosensitive element 13 and a secondpartial surface 1204 connected to the first partial surface 1203, thesecond side surface 1202 has a third partial surface 1205 providedadjacent to the photosensitive element 13 and a fourth partial surface1206 connected to the third partial surface 1205, wherein a first angleof the first partial surface 1203 relative to an optical axis of thecamera module is greater than a second angle of the second partialsurfaces 1204 relative to the optical axis, and a third angle of thethird partial surface 1205 relative to the optical axis is greater thana fourth angle of the fourth partial surface 1206 relative to theoptical axis, so that the cross-sectional shapes of the first diversiongroove 2151 and the second diversion groove 2152 enable the moldingmaterial 14 to fill the base jointed panel molding guide groove 215 inthe molding process of forming the one-piece molding base 1200 and themolding material 14 can reach the terminal ends 215B of the firstdiversion groove 2151 and the second diversion groove 2152 from thefeeding ends 215A of the first diversion groove 2151 and the seconddiversion groove 2152, respectively;

cutting the photosensitive assembly jointed panel 1000 to obtain aplurality of photosensitive assemblies 10, wherein each of thephotosensitive assemblies 10 includes the circuit board 11, thephotosensitive element 13, and the molding base 12, wherein the moldingbase 12 is integrally molded on the circuit board 11 and thephotosensitive element 13 and forms the light window 122 that provides alight path for the photosensitive element 13.

And, the method may further include the step of cutting a portion of thephotosensitive assembly corresponding to the opposite second end side ofthe molding base 12 away from the flexible region 112, that is, a partof a portion 12B of the molding base and a part of the circuit board 11,so that the molding base 12B has a cutting surface 125 on the oppositesecond end side away from the flexible region 112.

As shown in FIGS. 5A to 6B, the circuit board 11 includes a plurality ofelectronic components 113 formed in the rigid region 111 and mounted bysuch as SMT process. The electronic components 113 include, but are notlimited to, resistors, capacitors, driving devices, etc. In thisembodiment of the present application, the molding base 12 integrallycovers the electronic component 113, so as to prevent dust and debrisfrom adhering to the electronic component 113, as in a conventionalcamera module, and further contaminating the photosensitive element 13,thereby affecting the imaging effect. In addition, preferably, theplurality of the electronic components 113 are provided on a first endside 11 A and a second end side 11B of the rigid area 111 of the circuitboard 11 except for the region adjacent to the flexible area 112 andaway from the flexible area 112, and at least one wing side 11C on bothsides of the photosensitive element 11 on the rigid region 111, whereinthe molding base 12 integrally embeds the electronic component 113.

That is, referring to FIGS. 8 and 9 , in the corresponding firstdiversion groove 2151 and second diversion groove 2152, the electroniccomponent 113 is not included, and the electronic component 113 may becollectively provided in the filling groove 2153, so that during themolding process, there will not be any block in the first diversiongroove 2151 and the second diversion groove 2152, so as not to affectthe molding material 14 from flowing forward along with the firstdiversion groove 2151 and the second diversion groove 2152, so that themolding material 14 flows from the feeding end 215A to the terminal end215B as soon as possible.

It can be understood that the connecting wires 15 may be provided onfour sides of the photosensitive element 13 or may be collectivelyprovided on both wing sides 11C of the rigid region 111 of the circuitboard 11, so that they are also collectively located in the fillinggroove 2153 during the molding process, thereby not affecting theforward flow of the molding material 14 along with the first diversiongroove 2151 and the second diversion groove 2152.

As shown in FIGS. 11 to 14 , the camera module 100 to which thephotosensitive assembly 10 of the present application is applied ismanufactured. The camera module includes a photosensitive assembly 10, alens 20 and a filter assembly 30. The photosensitive assembly 10includes the circuit board 11, the molding base 12 and thephotosensitive assembly 13. The lens 20 includes a structural member 21and one or more lenses 22 accommodated in the structural member 21. Thefilter assembly 30 includes a filter element lens holder 31 and a filterelement 32. The filter element lens holder 31 is assembled on the topside of the molding base 12, and the lens 20 is directly assembled onthe top side of the filter element lens holder 31 to form a fixed focuscamera module. Wherein in this embodiment, the top side of the moldingbase 12 is a flat surface, the filter element lens holder 31 isassembled on the flat top surface of the molding base 12, and the filterelement 32 plays a role of filtering the light passing through the lens20, for example, it can be implemented as a filter for filteringinfrared rays, which is located between the lens 20 and thephotosensitive element 13. In this way, the light passing through thelens 30 can pass through the filter element 32 and reach thephotosensitive element 13 through the light window 122, so that afterthe photoelectric conversion effect, the camera module 100 can be madeto provide an optical image.

As shown in FIG. 13A, in the photosensitive assembly 10 of the cameramodule 100, a portion 12A of the molding base corresponding to the firstend side of the molding base 12 adjacent to the flexible region 112 hasa first side surface 1201 facing the light window, and a portion 12B ofthe molding base corresponding to the opposite second end side of themolding base 12 away from the flexible region 112 has a second sidesurface 1202 facing the light window, wherein the first side surface1201 includes a first partial surface 1203 provided adjacent to thephotosensitive element 13 and a second partial surface 1204 connected tothe first partial surface 1203, the second side surface 1202 has a thirdpartial surface 1205 provided adjacent to the photosensitive element 13and a fourth partial surface 1206 connected to the third partial surface1205, wherein a first angle of the first partial surface 1203 relativeto an optical axis of the camera module is greater than a second angleof the second partial surface 1204 relative to the optical axis, and athird angle of the third partial surface 1205 relative to the opticalaxis is greater than a fourth angle of the fourth partial surface 1206relative to the optical axis, so that the small-sized photosensitiveassembly 10 can be obtained, so that the overall size of the cameramodule 100 is further reduced. It can be understood that the oppositesecond side of the molding base 12 away from the flexible region 112 canbe further formed into a cutting side, so that the remaining part afterthe molding base 12 being cut has a cutting surface 125, as shown inFIG. 4 . In addition, as shown in FIG. 13B, it can be seen that, theelectronic components 113 may be collectively provided on at least oneof the two wing sides of the photosensitive assembly 10, for example,may be collectively located on the two wing sides.

It can be understood that, in another variant embodiment, the filterelement lens holder 31 may not be provided, and the filter element 32may be directly assembled on the molding base 12, or the filter element32 is assembled on the lens 20, or the filter element 32 is assembled toa load-supporting part of the lens 20, such as a driver or a fixed lensbarrel.

As shown in FIG. 15 , the camera module 100 may include aload-supporting part 40, which is a driver or a fixed lens barrel, inthis figure, it is a driver such as a voice coil motor, a piezoelectricmotor, etc., to form a variable-focus camera module, the lens 20 ismounted on the driver. The molding base 12 has a groove 123 on the topside, which can be used to mount the filter element lens holder 31, andthe driver can be directly mounted on the top side of the molding base12. It can be understood that, in another variant embodiment, theload-supporting part 40 may also be mounted on the filter element lensholder 31, or a part of the load-supporting part 40 may be mounted onthe filter element lens holder 31, and the other part thereof may bemounted on the molding base 12.

As shown in FIG. 16 , in this embodiment of the present application andin the drawings, the camera module 100 may include a load-supportingpart 40, which is a fixed lens barrel, and the lens 20 is mounted on thefixed lens barrel. The molding base 12 has a groove 123 on the top side,which can be used to mount the filter element lens holder 31, and thefixed lens barrel is mounted on the top side of the molding base 12.

As shown in FIGS. 17A to 24 , the photosensitive assembly 10 of thecamera module 100 according to a second embodiment of the presentapplication and a manufacturing process thereof are shown. In thisembodiment, a photosensitive assembly jointed panel 1000 is also made bya jointed panel operation, and then cut to obtain the photosensitiveassembly 10. In the embodiments shown in FIGS. 2 to 16 , in a pluralityof rows of circuit boards, the rigid regions 111 of one row of thecircuit boards are arranged adjacent to the flexible regions 112 of theother row of the circuit boards. In this embodiment, the two adjacentrows of the circuit boards can arrange the rigid regions 111 adjacently,and keep the corresponding flexible regions 112 away from each other.More preferably, the rigid regions 111 of the two adjacent rows of thecircuit boards are integrally molded, so that the middle of the twoadjacent rows of the circuit boards forms an integral rigid region.

Accordingly, more specifically, the molding die 210 forms a moldingcavity 213 when clamping, and provides a plurality of light windowmolding portions 214 and one or more base jointed panel molding guidegrooves 215, each of the base jointed panel molding guide groove 215includes a first diversion groove 2151 arranged at two ends in asubstantially parallel direction in the longitudinal direction, a seconddiversion groove 2152 located between two of the first guide grooves2151, and a plurality of the filling grooves 2153 arranged in ahorizontal direction extending between the two first diversion grooves2151 and the second diversion groove 2152, wherein two rows of thefilling grooves 2153 extend respectively between the two first diversiongrooves 2151 and the second diversion groove 2152.

For example, in this embodiment, the circuit board jointed panel 1100includes four rows of the circuit boards 11, and two rows of the circuitboards 11 as a group, and the rigid regions 111 of the two rows of thecircuit boards 11 of each group of the circuit boards 11 are located inthe middle and are integrally molded, for example, each row of thecircuit boards 11 has six circuit boards, and its rigid region 111 isintegrally molded. The molding die 210 has two base jointed panelmolding guide grooves 215, and each of the base jointed panel moldingguide grooves 215 has 7 filling grooves 2153 between each of the firstdiversion groove 2151 and the second diversion groove 2152, and thereare filling grooves 2153 between two adjacent light window moldingportions 214, each of the light window molding portions 214 is locatedbetween two adjacent filling grooves 2153. The molding material 14 flowsalong the two first diversion grooves 2151 and the middle seconddiversion groove 2152 from the feeding end 215A to the terminal end215B, and a two-stage design is adopted for the side surfaces of thefirst diversion groove 2151 and the second diversion groove 2152 facingthe light window, the molding material 14 can fill each of the fillinggrooves 2153, so that the molding material 14 forms the one-piecemolding base 1200 after being cured.

In this embodiment of the present application, the one-piece moldingbase 1200 is integrally molded on two adjacent rows of the circuitboards 11 and two adjacent rows of the photosensitive elements 13 toform a photosensitive assembly jointed panel 1000 and form a lightwindow 122 that provides a light path for each of the photosensitiveelements 13 at a position corresponding to the light window moldingportion 214.

As shown in FIGS. 21A to 24 , it is a schematic view of a manufacturingprocess of the photosensitive assembly jointed panel 1000 of the cameramodule 100 according to the preferred embodiment of the presentapplication. As shown in FIG. 21A, the molding die 210 is in a clampingstate, the circuit board 11 to be molded and the solid molding material14 are ready to be in place, the solid molding material 14 is heated,thereby when the molding material 14 is melted into a fluid state or asemi-solid and semi-fluid state, it is sent to the base jointed panelmolding guide groove 215, and along the first diversion groove 2151 andthe second diversion groove 2152 flows forward and fills the fillinggroove 2153 between two adjacent light window forming portions 214. Asshown in FIGS. 22 and 23 , when the two first diversion grooves 2151,the second diversion groove 2152, and the filling groove 2153 of thebase jointed panel molding guide groove 215 are all filled with thefluid-like molding material 14, then the fluid-like molding material 14is cured and molded into the one-piece molding base 1200 integrallymolded on two adjacent rows of the circuit board 11 and two rows of thephotosensitive elements 13 through a curing process.

As shown in FIG. 24 , after the molding material 14 is cured to form theone-piece molding base 1200, the demolding process of the presentapplication is performed, that is, the die fixing device 230 makes thefirst die 211 and the second die 212 to be away from each other, so thatthe light window molding portion 214 is separated from the one-piecemolding base 1200, so that two rows of the light windows 122corresponding to each of the photosensitive elements 13 are formed inthe one-piece molding base 1200.

As shown in FIG. 20B, the prepared photosensitive assembly jointed panel1000 can be further cut to obtain an individual photosensitive assembly10. Each of the photosensitive assemblies 10 includes at least onecircuit board 11, at least one photosensitive element 13 and the moldingbase 12 integrally molded on the circuit board 11 and the photosensitiveelement13. As shown in FIGS. 19A to 20B, the rigid regions 111integrally molded between the two adjacent rows of the circuit boards 11are separated, so that each of the circuit boards 11 includes a rigidregion 111 and a flexible region 112 combined with each other. Themolding base 12 integrally molds the rigid region 111 of the circuitboard 11 and at least a part of the non-photosensitive region 132 of thephotosensitive element 13, and forms the light window 122 that providesa light path for the photosensitive region 131 of the photosensitiveelement 13.

It is worth mentioning that when each of the individual photosensitiveassemblies 10 produced by cutting the photosensitive assembly jointedpanel 1000 is used to make a variable-focus camera module, that is, anautofocus camera module, the molding die 210 is further provided with aplurality of driver pin groove molding blocks 218, and each of thedriver pin groove molding blocks 218 extends into the filling groove2153 of the base jointed panel molding guide groove 215, so as not toaffect the flow of the molding material 14 in three of the diversiongrooves 2151, 2152 and 2153, and during the molding process, thefluid-like molding material 14 does not fill the position correspondingto each of the driver pin groove molding blocks 218, so that after thecuring step, a plurality of the light windows 122 and a plurality ofdriver pin grooves 124 are formed in the one-piece molding base 1200 ofthe photosensitive assembly jointed panel 1000, and the molding base 12of each of the individual photosensitive assemblies 10 obtained bycutting is configured with the driver pin groove 124, so that when thevariable-focus camera module 100 is manufactured, the driver pins can beconnected to the circuit board 11 of the photosensitive assembly 10 bymeans of soldering or conductive adhesive.

It is worth mentioning that the manufacturing method of thephotosensitive assembly jointed panel 1000 of the present application issuitable for manufacturing the photosensitive assembly 10 with a smallsize. In the molding process, each of the first diversion grooves 2151has a first side surface 1201 facing the light window, and the seconddiversion groove 2152 has a second side surface 1202 facing the lightwindow, wherein the first side surface 1201 includes a first partialsurface 1203 provided adjacent to the photosensitive element 13 and asecond partial surface 1204 connected to the first partial surface 1203,the second side surface 1202 has a third partial surface 1205 providedadjacent to the photosensitive element 13 and a fourth partial surface1206 connected to the third partial surface 1205, wherein a first angleof the first partial surface 1203 relative to an optical axis of thecamera module is greater than a second angle of the second partialsurface 1204 relative to the optical axis, and a third angle of thethird partial surface 1205 relative to the optical axis is greater thana fourth angle of the fourth partial surface 1206 relative to theoptical axis. In this way, the fluid-like molding material 14 can flowforward along the two outer first diversion grooves 2151 and the middlesecond diversion groove 2152, and before the molding material 14 iscured, the entire base jointed panel molding guide groove 215 is filledwith the molding material 14.

Accordingly, the molding process of the present application obtains thephotosensitive assembly jointed panel 1000, including: one or more rowsof the circuit board 11, one or more rows of the photosensitive elements13, and one or more one-piece molding bases 1200. Each row of thecircuit boards 11 includes one or more circuit boards 11 arranged sideby side, each of the circuit boards 11 includes the rigid region 111 andthe flexible region 112 combined with each other. Each of the one-piecemolding bases 1200 is integrally molded on two adjacent rows of thecircuit boards 11 and two adjacent rows of the photosensitive elements13, and forms a light window 122 that provides a light path for each ofthe photosensitive elements 13, and the two adjacent rows of the circuitboards 11 are arranged so that their flexible regions 112 are away fromeach other and their rigid regions 11 are adjacent to each other, sothat each of the one-piece molding bases 1200 has two end sides adjacentto the flexible regions; wherein a portion 1200A of the one-piecemolding base corresponding to each end side of the one-piece moldingbase 1200 adjacent to the flexible region 112 has a first side surface1201 facing the light window, a portion 1200B of the one-piece moldingbase 1200 extended between the two adjacent rows of the photosensitiveelements 13 has a second side surface 1202 facing the light window,wherein the first side surface 1201 includes a first partial surface1203 provided adjacent to the photosensitive element 13 and a secondpartial surface 1204 connected to the first partial surface 1203, thesecond side surface 1202 has a third partial surface 1205 providedadjacent to the photosensitive element 13 and a fourth partial surface1206 connected to the third partial surface 1205, wherein a first angleof the first partial surface 1203 relative to an optical axis of thecamera module is greater than the second angle of the second partialsurface 1204 relative to the optical axis; and a third angle of thethird partial surface 1205 relative to the optical axis is greater thanthe fourth angle of the fourth partial surface 1206 relative to theoptical axis. Wherein, each of the end sides of the one-piece moldingbase 1200 corresponds to a combined side of the rigid region 111 and theflexible region 112 of the circuit board 11, that is, a proximal sideadjacent to the flexible region 112; a distal side of the one-piecemolding base 1200 corresponds to the circuit board 11 and away from theflexible region 112 extends between two adjacent rows of thephotosensitive elements 13.

After the photosensitive assembly jointed panel 1000 is cut, anindividual photosensitive assembly 10 can be obtained, wherein, in thecutting step, it can be cut on the other side of the one-piece moldingbase 1200 except for the portion 1200A of the end side, so that themolding base 12 is obtained, wherein the portions 1200B of the moldingbase corresponding to the molding base between two adjacent rows of thephotosensitive elements 13 are also cut.

Accordingly, as shown in FIG. 20B, the photosensitive assembly 10obtained after cutting includes the circuit board 11, the photosensitiveelement 13 and the molding base 12. Wherein, the circuit board 11includes the rigid region 111 and the flexible region 112 combined witheach other. The molding base 12 is integrally molded on the circuitboard 11 and the photosensitive element 13 and forms the light window122 that provides a light path for the photosensitive element 13. Thecircuit board 11 and the photosensitive element 13 are connected througha series of connecting wires 15. After cutting the photosensitiveassembly jointed panel 1000, each of the photosensitive assemblies 10has a first end side without cutting and a second end side obtained bycutting similarly to the above embodiment. The portion 12A of themolding base corresponding to the first end side of the molding base 12adjacent to the flexible region 112 has a first side surface 1201 facingthe light window, the portion 12B of the molding base of correspondingto the opposite second end side of the molding base 12 away from theflexible region 112 has a second side surface 1202 facing the lightwindow, wherein the first side surface 1201 includes a first partialsurface 1203 provided adjacent to the photosensitive element 13 and asecond partial surface 1204 connected to the first partial surface 1203,the second side surface 1202 has a third partial surface 1205 providedadjacent to the photosensitive element 13 and a fourth partial surface1206 connected to the third partial surface 1205, wherein a first angleof the first partial surface 1203 relative to an optical axis of thecamera module is greater than a second angle of the second partialsurface 1204 relative to the optical axis, and a third angle of thethird partial surface 1205 relative to the optical axis is greater thana fourth angle of the fourth partial surface 1206 relative to theoptical axis. In this way, the shape of the cross-section is set so thatthe molding material 14 can fill the base jointed panel molding guidegroove 215 in the molding process, thereby avoiding the occurrence ofdefective products of the photosensitive assembly.

That is, in this embodiment of the present application, the moldingmaterial 14 can flow forward from the feeding ends 215A of the threediversion grooves 2151 and 2152 and fill the diversion grooves 2151 and2152 and the filling groove 2153 of the entire base jointed panelmolding guide groove 215. The molding material 14 can flow from thefeeding end 215A to the terminal end 215B along with the three diversiongrooves 2151 and 2152 before curing. In addition, before the viscosityof the molding material 14 reaches a high value and is cured, themolding material 14 can fill the base jointed panel molding guide groove215, thereby preventing the connecting wire 15 between the circuit board11 and the photosensitive elements 13 is damaged by the molding material14 with a high viscosity flowing forward. And the fluid in the threediversion grooves 2151 and 2152 flows forward substantially at the samestep, so as to prevent the molding material 14 in one diversion groovefrom flowing to the other diversion groove and obstructing the moldingmaterial 14 from flowing forward in the other diversion groove.Moreover, no turbulence or sinuous flow is generated, which causes theconnecting wires 15 connecting the circuit board 11 and thephotosensitive element 13 to swing irregularly, resulting in deformationand damage.

As shown in FIG. 21B, in order to facilitate demolding and pressing ofthe rigid region 111 of the circuit board 11, the first die 211 furtherincludes a plurality of the pressing blocks 216, and the outer edge 1201of the molding base 12 and the outer edge of the rigid region 111 of thecircuit board 11 will form a pressing edge 1111, that is, in the moldingprocess, the two pressing blocks 216 are pressed on a region of therigid regions 111 of the two rows of the circuit boards 11. The twopressing blocks 216 are pressed above each group of the flexible regions112 of the two adjacent rows of the circuit boards 11 to prevent themolding material 14 from flowing to the flexible regions 112. Inaddition, the rigid regions 111 of the two adjacent rows of the circuitboard 11 are integrally molded to form an integrated rigid regionjointed panel 110, and the two pressing blocks 216 respectively press onboth end sides of the integrated rigid region jointed panel 110, so asto facilitate the pressing of the first die 211 to the adjacent two rowsof the circuit boards 11. In addition, a width W of a bottom end of thefirst diversion groove 2151 is 0.2 mm to 1 mm, which is suitable formanufacturing the photosensitive assembly with a small size.Accordingly, the obtained photosensitive assembly 10 has a distance Wbetween an inner edge and an outer edge of the portion 12A of themolding base on a side adjacent to the flexible region 112 of 0.2 mm to1 mm.

Accordingly, this embodiment of the present application provides amethod for manufacturing the photosensitive assembly 12 of the cameramodule 100, which includes the following steps:

fixing a circuit board panel 1100 to a second die 212 of a molding die210, wherein the circuit board panel 1100 includes one or more rows ofcircuit boards, and each row of circuit boards includes one or morecircuit boards 11 arranged side by side, each of the circuit boards 11includes a combined rigid region 111 and flexible region 112, and eachof the circuit boards 11 is operatively connected with a photosensitiveelement 13;

clamping the second die 212 and a first die 211 through a die fixingdevice 213 to fill the molten molding material 14 in a base jointedpanel molding guide groove 215 in the molding die 210, wherein theposition corresponding to a light window molding portion 214 isprevented from being filled with the molding material 14;

curing the molding material 14 in the base jointed panel molding guidegroove 215 to form a one-piece molding base 1200 at a positioncorresponding to the base jointed panel molding guide groove 215,wherein the one-piece molding base1200 is integrally molded on twoadjacent rows of the circuit boards 11 and two adjacent rows of thephotosensitive elements 13 to form a photosensitive assembly jointedpanel 1000 and form a light window 122 that provides a light path foreach of the photosensitive elements 13 at a position corresponding tothe light window molding portion 214, wherein the two adjacent rows ofthe circuit boards 12 are arranged such that their flexible regions 112are away from each other and their rigid regions 11 are adjacent to eachother, wherein the base jointed panel molding guide groove 215 has twofirst diversion grooves 2151 corresponding to two end sides of theone-piece molding base 1200 adjacent to the flexible region 112 and asecond guide groove 2152 corresponding to a region between the twoadjacent rows of photosensitive elements 13, and a filling grooves 2153extending between the first diversion groove 2151 and the seconddiversion groove 2152 for filling the molding material 14 between twoadjacent photosensitive elements 13 in each row of the photosensitiveelements 13 and located between two adjacent light window moldingportions 214, wherein the first diversion groove 2151 has a first sidesurface 1201 facing the light window, and the second diversion groove2152 has a second side surface 1202 facing the light window, wherein thefirst side surface 1201 includes a first partial surface 1203 providedadjacent to the photosensitive element 13 and a second partial surface1204 connected to the first partial surface 1203, the second sidesurface 1202 has a third partial surface 1205 provided adjacent to thephotosensitive element 13 and a fourth partial surface 1206 connected tothe third partial surface 1205, a first angle of the first partialsurface 1203 relative to an optical axis of the camera module is greaterthan a second angle of the second partial surface 1204 relative to theoptical axis, and a third angle of the third partial surface 1205relative to the optical axis is greater than a fourth angle of thefourth partial surface 1206 relative to the optical axis.

cutting the photosensitive assembly jointed panel 1000 to obtain aplurality of the photosensitive assemblies 10, wherein each of thephotosensitive assemblies 10 includes the circuit board 11, thephotosensitive element 13 and the molding base 12, wherein, the moldingbase 12 is integrally molded on the circuit board 11 and thephotosensitive element 13 and forms the light window 122 that provides alight path for the photosensitive element 13.

In addition, the method may further include the step of cutting a partof the photosensitive assembly 10 located between the two adjacent rowsof the photosensitive elements 13 to obtain a portion 12B of the moldingbase of corresponding to the opposite other end side of the molding base12 away from the flexible region 112. That is, from the molding base 12of the photosensitive assembly 10 and the rigid region 111 of thecircuit board 11 between the two adjacent rows of the photosensitiveelements 13, it is suitable to be cut so that the distal sides of thetwo adjacent rows of the photosensitive elements 10 away from theflexible region 112 are cutting sides, and respectively form cuttingsurfaces 125.

The circuit board 11 includes a plurality of electronic components 113formed in the rigid region 111, and mounted such as by an SMT process,in corresponding two of the first diversion grooves 2151 and the seconddiversion grooves 2152, there is no electronic component 113, theelectronic component 113 can be collectively provided in the fillinggroove 2153, so that in the molding process, there will be noobstruction in the two first diversion grooves 2151 and the seconddiversion groove 2152, so that the molding material 14 will not beaffected to flow forward along with two first diversion grooves 2151 andthe second diversion groove 2152, so that the molding material 14 triesto flow from the feeding end 215A to the terminal end 215B in arelatively short time.

In the step of manufacturing the individual photosensitive assembly 10:the photosensitive assembly jointed panel 1000 may be cut to obtain aplurality of independent photosensitive assemblies 10 for manufacturingan individual camera module. It is also possible to cut and separate twoor more of the photosensitive assemblies 10 integrally connected fromthe photosensitive assembly jointed panel 1000 to be used to make aseparate array camera module, that is, each of the camera modules of thearray camera modules has the independent photosensitive assembly 10,wherein two or more of the photosensitive assemblies 10 can berespectively connected to a control motherboard of a same electronicdevice, so that an array camera module made by two or more of thephotosensitive assemblies 10 can transmit the images captured by themultiple camera modules to the control motherboard for image informationprocessing.

As shown in FIG. 25A, the photosensitive assembly 1000 according toanother variant embodiment based on the first embodiment of the presentapplication, which includes an inventive molding process to obtain thephotosensitive assembly 1000, including: one or more rows of the circuitboard 11, one or more rows of the photosensitive elements 13, one ormore rows of protective frames 16, and one or more of the one-piecemolding bases 1200. Each row of the circuit boards 11 includes one ormore circuit boards 11 arranged side by side, and each of the circuitboards 11 includes a rigid region 111 and flexible region 112 combinedwith each other. Each of the protective frames 16 is formed in thephotosensitive element 13 and is located in the non-photosensitiveregion 132 of the photosensitive element 13, that is, it is locatedoutside the photosensitive region 131, and each of the one-piece moldingbases 1200 is integrated molded on a row of the circuit boards 11, a rowof the photosensitive elements 13, and a row of the protective frames 16and forms the light windows 122 that provide a light path for each ofthe photosensitive elements 13.

That is, before the one-piece molding base 1200 is molded, theprotective frame 16 is formed on each of the photosensitive elements 13in advance, which may be formed of another material different from themolding material 14, for example, it may be glue applied to thenon-photosensitive region 132 of the photosensitive element 13, or itmay be a rigid frame and attached to the non-photosensitive region 132of the photosensitive element 13 by glue. Therefore, in the process ofmolding and forming the one-piece molding base 1200, the light windowmolding portion 214 is pressed on the protective frame 16 having apredetermined hardness, when the fluid-like molding material 14 entersthe base jointed panel molding guide groove 215, the fluid-like moldingmaterial 14 can be prevented from flowing into the photosensitive region131 of the photosensitive element 13, thereby forming a molding flash.For example, in a specific example, the protective frame 16 is formed ofglue, which has a predetermined elasticity and hardness, and can befurther implemented to be still sticky after being cured, so as to beused for adhering dust particles in the photosensitive assembly 10 ofthe obtained camera module. More specifically, in some embodiments, theShore hardness of the protective frame 16 ranges from A50 to A80, andthe elastic modulus ranges thereof is from 0.1 Gpa to 1 Gpa.

Similarly, a portion 1200A of the one-piece molding base correspondingto the first end side of the one-piece molding base 1200 adjacent to theflexible region 112 has a first side surface 1201 facing the lightwindow; a portion 1200B of the one-piece molding base corresponding tothe opposite second end of the one-piece molding base 1200 away from theflexible region 112 has a second side surface 1202 facing the lightwindow. Wherein, the first side surface 1201 includes a first partialsurface 1203 provided adjacent to the photosensitive element 13 and asecond partial surface 1204 connected to the first partial surface 1203,the second side surface 1202 has a third partial surface 1205 providedadjacent to the photosensitive element 13 and a fourth partial surface1206 connected to the third partial surface 1205, wherein a first angleof the first partial surface 1203 relative to an optical axis of thecamera module is greater than a second angle of the second partialsurface 1204 relative to the optical axis, and a third angle of thethird partial surface 1205 relative to the optical axis is greater thana fourth angle of the fourth partial surface 1206 relative to theoptical axis. Wherein, the first end side of the one-piece molding base1200 corresponds to a combined side of the rigid region 111 and theflexible region 112 of the circuit board 11, that is, the proximal sidenear the flexible region 112; the second end side of the one-piecemolding base 1200 corresponds to the distal side of the circuit board 11away from the flexible region 112.

After the photosensitive assembly jointed panel 1000 is cut, a singlethe photosensitive assembly 10 can be obtained, as shown in FIG. 25C,wherein in the cutting step, it can be cut on the two wing sides of theone-piece molding base 1200 except for the first end side and the secondend side to obtain the molding base 12, and the portion 1200B of themolding base corresponding to the second end side is not cut, so thatthe photosensitive assembly 10 with a portion 1200C of the one-piecemolding base on a pair of opposite wing sides is obtained.

Accordingly, the photosensitive assembly 10 includes the circuit board11, the photosensitive element 13, the protective frame 16, and themolding base 12. Wherein, the circuit board 11 includes a rigid region111 and flexible region 112 combined with each other. The molding base12 is integrally molded on the circuit board 11, the photosensitiveelement 13 and the protective frame 16 and forms the light window 122that provides a light path for the photosensitive element 13. Thecircuit board 11 and the photosensitive element 13 are connected througha series of connecting wires 15. The protection frame 16 may be locatedat inner side of the connection wire 15, or may cover at least a part ofthe connection wire 15. The portion 12A of the molding basecorresponding to the first end side of the molding base 12 adjacent tothe flexible region 112 has a first side surface 1201; the portion 12Bof the molding base corresponding to the opposite second end side of themolding base 12 away from the flexible region 112 has a second sidesurface 1202. Wherein, the first side surface 1201 includes a firstpartial surface 1203 provided adjacent to the photosensitive element 13and a second partial surface 1204 connected to the first partial surface1203, the second side surface 1202 has a third partial surface 1205provided adjacent to the photosensitive element 13 and a fourth partialsurface 1206 connected to the third partial surface 1205, wherein afirst angle of the first partial surface 1203 relative to an opticalaxis of the camera module is greater than a second angle of the secondpartial surface 1204 relative to the optical axis, and a third angle ofthe third partial surface 1205 relative to the optical axis is greaterthan a fourth angle of the fourth partial surface 1206 relative to theoptical axis.

As shown in FIG. 25C, accordingly, in order to further reduce the sizeof the photosensitive assembly 10, at least a part of the photosensitivemember 10 of the opposite second end side of the molding base 12 awayfrom the flexible region 112 is suitable to be removed to form a cuttingsurface 125.

As shown in FIG. 25B, the photosensitive assembly jointed panel 1000 isobtained by a molding process according to the variant embodiment of theabove-mentioned second embodiment of the present application, and itincludes: one or more rows of the circuit boards 11, one or more rows ofthe photosensitive elements 13, one or more rows of protective frames16, and one or more of the one-piece molding base 1200, each of theprotective frames 16 is formed on the corresponding photosensitiveelement 13. Each row of the circuit boards 11 includes one or morecircuit boards 11 arranged side by side, and each of the circuit boards11 includes a rigid region 111 and flexible region 112 combined witheach other. Each of the one-piece molding bases 1200 is integrallymolded in two adjacent rows of the circuit boards 11, two adjacent rowsof the photosensitive elements 13, and two adjacent rows of theprotective frames 16 and form a light window 122 that provides a lightpath for each photosensitive element 13, and the two adjacent rows ofthe circuit boards 11 are arranged such that their flexible regions 112are far away from each other and their rigid regions 11 are adjacent toeach other, so that each of the one-piece molding bases 1200 has two endsides adjacent to the flexible region 112; wherein portions 1200A of theone-piece molding base corresponding to respective end sides of theone-piece molding base 1200 adjacent to the flexible region 112 has afirst side surface 1201; the one-piece molding base 1200 extends betweenthe two adjacent rows of the photosensitive elements 13 and has a secondside surface 1202. Wherein, the first side surface 1201 includes a firstpartial surface 1203 provided adjacent to the photosensitive element 13and a second partial surface 1204 connected to the first partial surface1203, the second side surface 1202 has a third partial surface 1205provided adjacent to the photosensitive element 13 and a fourth partialsurface 1206 connected to the third partial surface 1205, wherein afirst angle of the first partial surface 1203 relative to an opticalaxis of the camera module is greater than a second angle of the secondpartial surface 1204 relative to the optical axis, and a third angle ofthe third partial surface 1205 relative to the optical axis is greaterthan a fourth angle of the fourth partial surface 1206 relative to theoptical axis. Wherein, each of the end sides of the one-piece moldingbase 1200 corresponds to a combined side of the rigid region 111 and theflexible region 112 of the circuit board 11, that is, the proximal sidenear the flexible region 112; the distal side of the one-piece moldingbase 1200 corresponding to the circuit board 11 away from the flexibleregion 112 extends between two adjacent rows of the photosensitiveelements 13.

After the photosensitive assembly jointed panel 1000 is cut, anindividual photosensitive assembly 10 can be obtained, wherein, in thecutting step, the other side of the one-piece molding base 1200 exceptfor portion 1200A of the end side can be cut, so that the molding base12 is obtained, wherein a portion 1200B corresponding to the moldingbase between two adjacent rows of the photosensitive elements 13 arealso cut, so that the photosensitive assembly 10 with the portion 1200Cof the one-piece molding base on a pair of opposite wing sides isobtained. A portion 12A of the molding base corresponding to the firstend side of the molding base 12 adjacent to the flexible region 112 hasa first side surface 1201; the portion 12B of the molding basecorresponding to the opposite second end side of the molding base 12away from the flexibility region 112 has a second side surface 1202.Wherein, the first side surface 1201 includes a first partial surface1203 provided adjacent to the photosensitive element 13 and a secondpartial surface 1204 connected to the first partial surface 1203, thesecond side surface 1202 has a third partial surface 1205 providedadjacent to the photosensitive element 13 and a fourth partial surface1206 connected to the third partial surface 1205, wherein a first angleof the first partial surface 1203 relative to an optical axis of thecamera module is greater than a second angle of the second partialsurface 1204 relative to the optical axis, and a third angle of thethird partial surface 1205 relative to the optical axis is greater thana fourth angle of the fourth partial surface 1206 relative to theoptical axis, as shown in FIG. 25C.

As shown in FIGS. 26A to 27 , the molding process of the jointedpaneling operation can also be used to make a photosensitive assembly 10having two or more of the light windows 122, wherein such aphotosensitive assembly 10 can be used to fabricate an array cameramodule that shares a substrate. That is, taking the photosensitiveassembly 10 for making a dual-camera module as an example, during themolding process of each circuit board 11 of the circuit board jointedpanel 1100, one circuit board substrate 111 is correspondingly providedwith two light window molding portions 214, so that after the moldingprocess and cutting are completed, each of the circuit boards 11 forms amolding base 12 having two of the light windows 122 sharing one circuitboard 11, and correspondingly mounts the two photosensitive elements 13and two lenses 30. In addition, the circuit board 11 can be connected toa control motherboard of an electronic device. In this way, the arraycamera module manufactured in this embodiment can transmit imagescaptured by multiple camera modules to the control motherboard for imageinformation processing.

As shown in FIGS. 28A to 31C are a camera module 400 and aphotosensitive assembly 410 thereof according to a third preferredembodiment of the present application. The camera module 400 can beapplied to various electronic devices 300, as shown in FIG. 44 , theelectronic device 300 includes a device main body 301 and one or morecamera modules mounted in the device main body 301. The electronicdevice 300 is exemplified, but not limited to, a smart phone, a wearabledevice, a computer device, a television, a vehicle, a camera, amonitoring device, etc., and the camera module cooperates with theelectronic device to implement image acquisition and reproduction of atarget object.

More specifically, the camera module 400 illustrated in the figureincludes the photosensitive assembly 410 and a lens 430. Thephotosensitive assembly 410 includes a circuit board 411, a molding base412, a photosensitive element 413, and a filter element 414. The moldingbase 412 includes a base main body 4121, which is integrally molded onthe circuit board 411 and the photosensitive element 413 and form alight window 4122. The light window 4122 is a closed space and providesa light path for the photosensitive element 413. Wherein, the moldingbase 412 of the present application is integrally molded on the circuitboard 411 and the photosensitive element 413 through a molding process,such as a transfer molding process, so that the molding base 412 canreplace a lens holder or a bracket of a conventional camera module anddoes not need to be attached to the circuit board 411 by glue as in aconventional packaging process. The filter element 414, for example, aninfrared filter element, is assembled on the top side of the moldingbase 412 and is located between the photosensitive element 413 and thelens 430 so as to filter infrared light passing through the lens 430.

The circuit board 411 may be a hard board, a soft-board, a soft-hardcombined board, a ceramic substrate, or the like. In this embodiment,the circuit board 411 is a soft-hard combined board including asubstrate 4111 and a plurality of the electronic components 4112 formedon the substrate 4111, such as being mounted by an SMT process. Theelectronic components 4112 include but not limited to resistors,capacitors, driving devices, etc. In this embodiment of the presentapplication, the molding base 412 integrally covers the electroniccomponent 4112, so as to prevent dust and sundries from sticking to theelectronic component 4112 and further contaminating the photosensitiveelement 413 as in a conventional camera module, thereby affecting theimaging effect. It can be understood that, the circuit board 411 may nothave the electronic component 4112, and the electronic component 4112may be mounted on the top surface of the substrate 4111 or may bemounted on the bottom surface of the substrate 4111, or may be buried inthe substrate 4111. When provided on the top surface of the substrate4111, the electronic component 4112 may be provided around thephotosensitive element 413 and located on multiple sides of thephotosensitive element 413, for example, the electronic component 4112may be provided on the two pairs of opposite sides of the photosensitiveelement 413, or may also be provided on a pair of opposite sides of theelectronic component 4112.

The circuit board 411 and the photosensitive element 413 are operativelyconnected, as shown in the figures, the surfaces of the circuit board411 and the photosensitive element 413 each have an electricalconnection element, such as a pad, and the two are connected by one ormore sets of connecting wires 415, and the molding base 412 integrallyembeds the connecting wires 415.

In this preferred embodiment of the present application, the cameramodule 400 includes the photosensitive assembly 410, the lens 430, and alens supporting element 440. The lens 430 is assembled on the lenssupporting element 440 to form a lens assembly. The lens supportingelement 440 may be a driver or a fixed lens barrel. In this embodiment,the lens supporting element is a driver, and the driver may beimplemented as a voice coil motor, a piezoelectric motor, athermodynamic driver, a micro-electro-mechanical driver, etc. toimplement an autofocus function, thereby forming an autofocus cameramodule. It can be understood that, in another embodiment, the lens 430may be directly assembled on the molding base 412 of the photosensitiveassembly 410.

The filter element 414 includes a filter element main body 4141 and alight shielding layer 4142. The light shielding layer 4142 is located ona bottom side of the filter element main body 4141 and is locatedbetween the filter element main body 4141 and the molding base 412, andthe light shielding layer 4142 is a light-absorbing material, whichmakes the filter element main body 4141 form an intermediate effectivelight transmitting region 41411 and a surrounding region 41412, thelight passing through the lens 430 can only reach the inside of themolding base 412 through the effective light transmitting region 41411,the material of the filter element main body 141 may include an IR film(infrared cut film), an AR film (anti-reflection coating), white glass,blue glass, resin materials, coated composite materials, crystals, etc.The light shielding layer 4142 is a ring structure, and an openingwindow is formed in the middle, That is, the light shielding layer 4142forms a light path 41420 for allowing light to enter the light window4122 and then reach the photosensitive element 413 and reduce the straylight reaching the photosensitive element 413.

The photosensitive element 413 has a photosensitive region 4131 in themiddle and a non-photosensitive region 4132 located around thephotosensitive region 4131. Light shielding layer 4142 has an inner edge41421 and an outer edge 41422. The distance between the inner edge 41421of the light shielding layer 4142 and the optical axis Xis greater thanor equal to, or slightly smaller than the distance between the outeredge 41311 of the photosensitive region 4131 and the optical axis X.

The outer edge 41422 of the light shielding layer 4142 is locatedoutside the inner edge 41241 of the top surface 4124 of the molding base412, that is, no light transmitting region is formed between the inneredge 41241 of the top surface 4124 of the molding base 412 and the outeredges 41422 of the light shielding layer 4142.

In this embodiment of the present application, the inner surface of thebase main body 4121 of the molding base 412 has a plurality of sectionsof an inner surface along its surrounding direction, for example, it maybe four sections of the inner surface, and each of the sections of theinner surface includes multiple parts extending in different directions,for example, the base main body 4121 of the molding base 412 includethree parts, that is, a photosensitive element coupling portion 41211and a top side extending portion 41212 located around the light window4122 as shown in FIG. 29A, and a circuit board coupling portion 41213integrally coupled to the outer peripheral surface of the photosensitiveelement 413 and the top surface of the circuit board 411 located aroundthe photosensitive element 413, these three parts are integrallyextended to form a whole structure. The photosensitive element couplingportion 41211 and the photosensitive element coupling portion 41211 havean inner surface integrally extending from the photosensitive element413, wherein at least a section of the inner surface of the surroundinginner surface integrally extending from the photosensitive element 413is defined as a first portion inner surface 41231 of the molding base412, and the top side extending portion 41212 has an inner surfaceextending integrally from the photosensitive element coupling portion41211, which forms a second portion inner surface 41232 of the moldingbase 412, the second portion inner surface 41232 integrally extends fromthe first portion inner surface 41231. It can be understood that, eachof the first portion inner surfaces 41231 and the second portion innersurfaces 41232 is a certain section of the inner surface of thesurrounding inner surface of the base main body 4121; or the firstportion inner surface 41231 and the second portion inner surface 41232with the same configuration of a plurality of the sections of the innersurface; or the first portion inner surface 41231 and the second portioninner surface 41232 of all the inner surfaces. The inner surfaces 41231and 41232 of the photosensitive element coupling portion 41211 and thetop side extending portion 41212 extend at different slopes,respectively, the second portion inner surface 41232 of the top sideextending portion 41212 extends upward with a greater slope with respectto the first portion inner surface 41231 of the photosensitive elementcoupling portion 41211, or the second portion inner surface 41232 of thetop side extending portion 41212 extends upward without a slope, thatis, the second portion inner surface 41232 of the top side extendingportion 41212 extends substantially perpendicular to the top surface ofthe photosensitive element 413, the top side extending portion 41212becomes a vertical extending portion, so that the area of the topsurface of the top side extending portion 41212 can be relatively large,that is, the top surface of the top side extending portion 41212determines the area of the top surface 4124 of the molding base 412, anextension structure of such the photosensitive element coupling portion41211 and the top side extending portion 41212 can increase the area ofthe top surface 4124 of the molding base 412, so that a greater mountingarea can be provided for a lens or a lens assembly above thephotosensitive assembly 410 to more securely mount the lens or lensassembly above, and can reduce the area of the filter element 414.

That is, in order to facilitate the demolding of the molding process andprevent the stray light, the first portion inner surface 41231 definedby the structure formed by the photosensitive element coupling portion41211 for its inner surface extends obliquely upward from thephotosensitive element 413 with a relatively small slope, and the secondportion inner surface 41232 defined by the inner surface of the top sideextending portion 41212 extends integrally from the first portion innersurface 41231 in a twisted manner, and extends upward with a relativelylarge slope or no slope, that is, an included angle is formed betweenthe second portion inner surface 41232 and the first portion innersurface 41231 of the molding base 412, so that, with respect to theoblique upward extension with a fixed slope, the area of the top surface4124 of the molding base 412 can be effectively increased.

As shown in FIG. 29B, an included angle of the first portion innersurface 41231 defined by the inner surface of the photosensitive elementcoupling portion 41211 relative to the optical axis X of the cameramodule 400 is α, and an included angle of the second portion innersurface 41232 defined by the inner surface of the top side extendingportion 41212 relative to the optical axis X of the camera module 400 isβ, wherein the value of α ranges from 3°˜80°, and the value of β rangesfrom 0°˜10°, and α>β. For example, in a specific embodiment, the valueof α is 3°, and the value of β is 0°; in a specific embodiment, thevalue of α is 30°, and the value of β is 0°; in a specific embodiment,the value of α is 60°, the value of β is 0°; in a specific embodiment,the value of α is 45°, and the value of β is 5°; in a specificembodiment, the value of α is 80°, β The value is 10°.

That is, the included angle β of the second portion inner surface 41232defined by the inner surface of the top side extending portion 41212relative to the optical axis X of the camera module 400 has a smallerangle with respect to the included angle α of the first portion innersurface 41231 defined by the inner surface of the photosensitive elementcoupling portion 41211 relative to the optical axis X of the cameramodule 400, so that the second portion inner surface 41232 of the topside extending portion 41212 extends upward with a greater slope or in adirection perpendicular to the photosensitive element 413, therebyincreasing the area of the top surface 4124 of the molding base 412.

As shown in FIG. 29B, in this preferred embodiment of the presentapplication, preferably, a value of a thickness H1 of the photosensitiveelement coupling portion 41211 ranges from 0.05 mm˜0.7 mm, and a valueof a thickness H2 of the top side extending portion 41212 ranges from0.02 mm˜0.6 mm. For example, in a specific embodiment, the value of thethickness H1 of the photosensitive element coupling portion 41211 is0.08 mm, and the value of the thickness H2 of the top side extendingportion 41212 is 0.5 mm; in a specific embodiment, the value of thethickness H1 of the photosensitive element coupling portion 41211 is 0.4mm, and the value of the thickness H2 of the top side extending portion41212 is 0.3 mm; in a specific embodiment, the value of the thickness H1of the photosensitive element coupling portion 41211 is 0.5 mm, thevalue of the thickness H2 of the top side extending portion 41212 is 0.1mm.

It can be understood that, the second portion inner surface 41232 of thetop side extending portion 41212 turns from the first portion innersurface 41231 and extends in a direction with a smaller angle relativeto the optical axis X, so that in the molding process, an indenterpressed onto the photosensitive element 413 can avoid the connectingwire 415 between the circuit board 411 and the photosensitive element413, thereby preventing the connecting wire 415 from being crushed. Thatis, in some cases, if the molding base 412 to be formed extends with arelatively small fixed slope, for example, the angle of the innersurface relative to the optical axis X is 45°˜80°, the indenter pressedon the photosensitive element 413 during the molding process may touchthe connecting wire 415 and cause the connecting wire 415 to be damaged.

As shown in FIG. 30 , an included angle α of the first portion innersurface 41231 defined by the inner surface of the photosensitive elementcoupling portion 41211 relative to the optical axis X of the cameramodule 400 may be relatively large, so that the light L12 incident onthe first portion inner surface 41231 is not directly reflected to thephotosensitive element 413 to form stray light. That is, thephotosensitive element coupling portion 41211 and the top side extendingportion 41212 cooperate with each other, the structure of thephotosensitive element coupling portion 41211 facilitates demolding andreduces the stray light. The top side extending portion 41212 is used toincrease the area of the top surface 4124 of the molding base 412, andsuch structure of the top side extending portion 41212 prevents theconnecting wire 415 from being crushed by the indenter during themolding process.

That is, preferably, as shown in FIG. 29B, a position 41230 where thefirst portion inner surface 41231 and the second portion inner surface41232 are connected is located at inner side of the outer edge 41321 ofthe photosensitive element 413, that is, a distance D1 between theposition 41230 where the first portion inner surface 41231 and thesecond portion inner surface 41232 are connected and the optical axis Xis smaller than a distance D2 between the outer edge 41321 of thenon-photosensitive region 4132 of the photosensitive element 413 and theoptical axis X, so that the size of the part between the photosensitiveelement coupling portion 41211 and the photosensitive element 413 issmaller, thereby reducing the possibility that the molding material 416generates “flash” in the molding process.

Further preferably, a position 41230 where the first portion innersurface 41231 and the second portion inner surface 41232 are connectedis located at inner side of the connecting wire 415, and the distance D1between the position 41230 where the first portion inner surface 41231and the second portion inner surface 41232 are connected and the opticalaxis X is smaller than the distance D3 between the connecting wire 415and the optical axis X. A turning point between the photosensitiveelement coupling portion 41211 and the top side extending portion 41112does not exceed the position where the connecting wire 415 is located,that is, the photosensitive element coupling portion 41211 completes thetransition to the top side extending portion 41112 before it has not yetextended to the position of the connecting line 415, so as to preventthe connecting wire 415 from being crushed by the indenter during themolding process. For example, when the top side extending portion 41212is a vertical extending portion, a distance between a position of theinner edge 41241 of the top surface 4124 of the molding base 412 and theoptical axis X of the camera module 400 is not smaller than the distancebetween the connecting wire 415 and the optical axis X of the cameramodule, so that the top side extending portion 41212 increases the areaof the top surface 4124 of the molding base 412 and is integrallyembedded the connecting wire 415 without damaging the connecting wire415.

It can be understood that the inner surface 41231 of the photosensitiveelement coupling portion 41211 of the molding base 412 extends obliquelyto facilitate the demolding operation in the molding process and reducestray light reaching the photosensitive element 413, and the innersurface 41232 of the top side extending portion 41212 extends integrallyfrom the inner surface 41231 of the photosensitive element couplingportion 41211 in a twisted manner, so that the photosensitive elementcoupling portion 41211 and the top side extending portion 41212cooperate to maximize the area of the top surface of the molding base412, in the case of reducing the stray light.

In addition, when the filter element 414 is provided with lightshielding layer 4142 on the bottom side, as shown in FIG. 30 , a part ofstray light L11 incident on the top surface of the filter element mainbody 4141 of the filter element 414 is reflected by the upper surface ofthe filter element main body 4141 without entering the light window 4122of the molding base 412, and when refracting into the surrounding region41412 outside the light transmitting region 41411 above the lightshielding layer 4142, it will be absorbed by the light shielding layer4142 and cannot enter the light window 4122 inside the molding base 412,so as to block a part of the stray light.

When another part of stray light L12 passes through the effective lighttransmitting region 41411 of the filter element main body 4141 andincidents on the first portion inner surface 41231, it will be reflectedupward to the light shielding layer 4142 by the inclined first portioninner surface 41231 of the molding base 412 or further reflected tolight shielding layer 4142 by the second portion inner surface 41232, soas to be absorbed by light shielding layer 4142, so as not to be furtherreflected and reach the photosensitive element 413, thereby affectingthe imaging quality of the camera module 400. Accordingly, the lightshielding layer 4142 is adjacent to the second portion inner surface41232 of the molding base 412, and the second portion inner surface41232 of the molding base 412 extends downward from the light shieldinglayer 4142, and a light suppression groove 41221 is formed between thelight shielding layer 4142, the first portion inner surface 41231 andthe second portion inner surface 41232, and on an outer side portion ofthe light window 4122, the light suppression groove 41221 is a space forsuppressing stray light. More specifically, as shown in FIG. 30 , thestray light L12 enters the light suppression groove 41221, so that itcannot be emitted from the light suppression groove 41221.

It can be understood that, because the light shielding layer 4142 isadjacent to the second portion inner surface 41232 of the molding base412, so that the light shielding layer 4142 effectively reduces thelight passing through the filter element main body 4141 to the secondportion inner surface 41232, thereby preventing the light incident onthe second portion inner surface 41232 from being reflected by thesecond portion inner surface 41232 and reaching the photosensitiveelement 413 to form stray light and affect the imaging quality of thecamera module 400. As shown in FIG. 30 , the second portion innersurface 41232 extends downward from the light shielding layer 4142, thelight shielding layer 4142 extends horizontally from the second portioninner surface 41232, an included angle γ is formed by the lightshielding layers 4142 and the second portion inner surfaces 41232, andthe included angle γ is an acute angle or a right angle, so that thelight suppression groove 41221 formed in such a structure prevents thelight incident on the inner surface 4123 from being reflected toward thephotosensitive element 413 to generates stray light.

The filter element 4141 may be mounted on the top surface 4124 of themolding base 412, such as being adhered to the top surface 4124 of themolding base 412 by glue. The light shielding layer 4142 is a blacklight absorbing opaque material, and can be formed on the bottom surfaceof the filter element main body 4141 in various ways, such as beingattached to the bottom surface of the filter element main body 4141, orthe light shielding layer 4142 is formed on the bottom surface of thefilter element main body 4141 by using a yellow light process or ascreen printing process.

FIGS. 31A to 31C are schematic diagrams illustrating a manufacturingprocess of the integrated assembly of the integrated circuit board 411,the molding base 412, and the photosensitive element 413 of thephotosensitive assembly 410 according to the present application. Themanufacturing equipment 4200 includes a molding die 4210, which includesa first die 4211 and a second die 4212 that is capable of die openingand clamping, that is, a mold fixing device is capable of making thefirst die 4211 and the second die 4212 being separated and closelycontacted to form a molding cavity 4213. When clamping, the circuitboard 411 connected to the photosensitive element 413 is fixed in themolding cavity 4213, and the fluid-like molding material 416 enters themolding cavity 4213, so as to be integrally molded on the circuit board411 and the photosensitive element 413, and after being cured, themolding base 412 integrally molded on the circuit board 411 and thephotosensitive element 413 is formed. It can be understood that, in theproduction process, the above-mentioned integrated assembly is usuallygenerated in a jointed panel manner, that is, a one-piece molding baseis formed on a circuit board jointed panel, then is cut to form theintegrated assembly of the present application. In FIGS. 31A to 31C,description is made by using an example to illustrate the formationprocess of one integrated assembly.

More specifically, the molding die 4210 further has a base molding guidegroove 4215 and a light window molding portion 4214 located in the basemolding guide groove 4215. When the first die 4211 and the second dies4212 are clamped, the light window molding portion 4214 and the basemolding guide groove 4215 extend in the molding cavity 4213, and thefluid-like molding material 416 is filled into the base molding guidegroove 4215, and the position corresponding to the light window moldingportion 4214 cannot be filled with the fluid-like molding material 416,so that at the position corresponding to the base molding guide groove4215, after being cured, the fluid-like molding material 416 can formthe molding base 412, which includes a ring-shaped molding base mainbody 4121 corresponding to the molding base 412 of each of thephotosensitive assemblies 410, and the light window 4122 of the moldingbase 412 is formed at a position corresponding to the light windowmolding portion 4214. The molding material 416 may be selected from, butnot limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene),epoxy resin, and the like.

More specifically, when the first and second dies 4211 and 4212 areclamped and a molding step is performed, the light window moldingportion 4214 is superimposed on the top surface of the photosensitiveelement 413 and closely adhered, so that the fluid-like molding material416 is prevented from entering the photosensitive region 4131 of thephotosensitive element 413 on the circuit board 411, so that the lightwindow 4122 of the molding base 412 can be finally formed at a positioncorresponding to the light window molding portion 4214. It can beunderstood that, the light window molding portion 4214 may be a solidstructure or a structure having a groove shape inside as shown in thefigure. It can be understood that, in another variation, an elastic film4217 may be further provided on the bottom side of the first die 4211 toprovide cushioning and facilitate demolding after the molding process.

As shown in FIGS. 31A to 31C, the light window molding portion 4214 ispressed on the photosensitive element 413, for correspondingly formingthe photosensitive element coupling portion 41211 and the top sideextending portion 41212 of the molding base 412, the light windowmolding portion 4214 has a bottom side molding portion 42141 and a topside molding portion 42142, the bottom side molding portion 42141 is afrustum shaped structure and has a gradually increasing inner diameterfrom the bottom side toward the top side. Wherein, An included angle αis formed between the outer surface 421411 of the bottom side moldingportion 42141 and the optical axis X (vertical direction shown in theFigure) perpendicular to the photosensitive element 413, an includedangle β is between the outer surface 421421 of the top side moldingportion 42142 and the optical axes X perpendicular to the photosensitiveelements 413. Accordingly, the value of α ranges from 3°˜80°, the valueof β ranges from 0°˜10°, and α>β. The top side molding portion 42142extends from the bottom side molding portion 42141 in a twist manner,and it will not be pressed against the connecting wire 415 during themolding process to cause damage to the connecting wire 415. The outersurface 411411 of the bottom side molding portion 42141 extendsobliquely instead of directly forming a sharp right angle, and itsheight is at least 0.05 mm, so as to prevent the elastic film 4217 frombeing punctured during the molding process.

The light window molding portion 4214 has a first portion outer surface421411 and a second portion outer surface 421421 in a direction from thebottom side toward the top side, which respectively form angles α and βwith the optical axis X perpendicular to the photosensitive element 413,the value of α ranges from 3°˜80°, the value of β ranges from 0°˜10°,and α>β. Thus, after the molding process, the molding base 412 is formedinto the photosensitive element coupling portion 41211 and the top sideextending portion 41212, and the first portion inner surface 41231defined by the structure formed by the photosensitive element couplingportion 41211 of which is an inner surface thereof extends obliquelyupward from the photosensitive element 413 with a relatively smallslope, and the second portion inner surface 41232 defined by the innersurface of the top side extending portion 41212 extends integrally fromthe first portion inner surface 41231 in a twisted manner, and extendsupward with a relatively large slope or no slope. That is, the includedangle of the first portion inner surface 41231 defined by the innersurface of the photosensitive element coupling portion 41211 relative tothe optical axis X of the camera module 400 is α, the included angle ofthe second partial inner surface 41232 defined by the inner surface ofthe top side extending portion 41212 relative to the optical axis X ofthe camera module 400 is β, wherein the value of α ranges from 3°˜80°,and the value of β ranges from 0°˜10°, and α>β. It can be understoodthat, such structure of the light window molding portion 4214 extendingin a twisted manner can reduce the molding material 416 entering thenon-photosensitive region 4132 of the photosensitive element 413 and thespace 41251 of the bottom side portion of the base molding guide groove4215 of the first portion outer surface 421411 of the light windowmolding portion 4214 in the molding process, so that the volume of themolding material 416 in the space is small, and the pressure andpressure force generated are relatively small, so that it is not easy toenter the photosensitive region 4131 of the photosensitive element 413,that is, avoiding the occurrence of “flash”.

In this molding process of the present application, a portion of thebottom side of the base molding guide groove 4215 located between thephotosensitive element 413 and the first portion outer surface 421411 ofthe molding base 412 forms a fill groove 42151. The molding material 416that is molded to form the molding base 412 does not easily enterbetween the photosensitive element 413 and the bottom surface of thelight window molding portion 4214 to form a “flash”, thereby reducingthe possibility that the photosensitive region 4131 of thephotosensitive element 413 is contaminated. More specifically, byreducing the volume of the filling groove 42151 between thephotosensitive element 413 and the first portion outer surface 421411 ofthe light window molding portion 4214, the pressure and pressure forcegenerated by the material 416 entering the filling groove 42151 isreduced, so that the possibility that the molding material 416 entersbetween the photosensitive element 413 and the bottom surface of thelight window molding portion 4214 to form a “flash” is reduced.

In this preferred embodiment of the present application, the outersurface of the light window molding portion 4214 has an outer surfaceextending in different directions, and the included angle of the topside outer surface of the light window molding portion 4214, i.e., thesecond portion outer surface 421421, relative to the optical axis X ofthe photosensitive assembly is smaller than the included angle of theouter surface of the bottom side of the light window molding portion4214, i.e., the first portion outer surface 421411, relative to theoptical axis X, thereby reducing the volume of the filling groove 42151formed between the first portion outer surface 421411 of the lightwindow molding portion 4214 and the photosensitive element 413, therebyreducing the possibility of the occurrence of “flash”. In addition, thesecond portion outer surface 421421 of the top side of the light windowmolding portion extends in a direction with a small included angle withthe optical axis X, so that unlike the inclined outer surfaceillustrated in FIG. 1B, which is convenient to guide the packagingmaterial into the filling groove, in this embodiment of the presentapplication, the second portion outer surface 421421 of the top side ofthe light window molding portion can play a certain degree of blockingeffect, that is, because it is from the first portion outer surface421411 extends integrally in a twist manner, not similar to the guidesurface structure extending linearly and obliquely in FIG. 1B, therebyslowing down the flow rate of the molding material 416 entering thefilling groove 42151 to a certain extent, and reducing the pressureforce generated when the molding material 416 enters the filling groove42151, thereby reducing the possibility of the occurrence of “flash”.Moreover, since the molding material 416 is not easy to form a “flash”in the integral molding process, the light window molding portion 4214does not need to be pressed onto the photosensitive element 413 with alarge pressure, thereby avoiding the photosensitive element 413 iscrushed. As shown in FIG. 32A, according to a variant embodiment of thethird preferred embodiment of the present application, in thisembodiment, a top side light shielding layer 4143 is further provided onthe top surface of the filter element main body 4141, so that the topside light shielding layer 4143 and light shielding layer 4142 cooperateto enhance the effect of reducing the stray light. More specifically,the light L21 incident on the top side light shielding layer 4143 isabsorbed by the top side light shielding layer 4143, and the light L22is absorbed by light shielding layer 4142. It can be understood that,the above third preferred embodiment may also be provided with the topside light shielding layer 4143.

As shown in FIG. 32B, according to a variant embodiment of the thirdpreferred embodiment of the present application, the camera module 400includes the photosensitive assembly 410, the lens 430, and a lenssupporting element 440. The lens 430 is assembled on the lens supportingmember 440 to form a lens assembly. The lens supporting element 440 maybe a fixed lens barrel, thereby forming a fixed focus camera module.

Accordingly, the photosensitive assembly 410 includes a circuit board411, a molding base 412, a photosensitive element 413, and a filterelement 414. The molding base 412 includes a base main body 4121, whichis integrally molded on the circuit board 411 and the photosensitiveelement 413 and form a light window 4122. The light window 4122 is aclosed space and provides a light path for the photosensitive element413. The filter element 414 includes a filter element main body 4141 anda light shielding layer 4142. The light shielding layer 4142 is a lightabsorbing opaque material, which is located on the bottom side of thefilter element main body 4141 and is located between the filter elementmain body 4141 and the molding base 412.

Wherein, the molding base 412 has a top side groove 4125 on a top sidethereof, and the top side groove 4125 is used for assembling the filterelement 414. That is, in this embodiment of the present application, thetop surface 4124 of the molding base 412 may be a multi-step surface,and the top surface 4124 is divided into non-coplanar multi-portion topsurfaces, such as a first portion top surface 4124 a and a secondportion top surface 4124 b, the first portion top surface 4124 a beingrecessed toward the photosensitive element 413 with respect to thesecond portion top surface 4124 b, so that a top side groove 4125 isformed on the top side of the first partial top surface 4124 a, and thefilter element 414 is assembled on the top side groove 4125.

The top side extending portion 41212 of the molding base 412 iscorrespondingly two-staged, and the top side groove 4125 is formed onthe top side thereof. The inner surface 4123 of the molding base 412includes the first portion inner surface 41231 of the photosensitiveelement coupling portion 41211 and the second portion inner surface41232 and the third portion inner surface 41233 formed by the top sideextending portion 41212, the light shielding layer 4142 is adjacent tothe second portion inner surface 41232 of the molding base 412, andforms The light suppression groove 41221 with the first portion innersurface 41231 and the second portion inner surface 41232, so that aspace for the stray light emission is formed. That is, the lightincident on the first portion inner surface 41231 is directly reflectedto light shielding layer 4142 or is further reflected to light shieldinglayer 4142 by the second portion inner surface 41232 to be absorbed bylight shielding layer 4142, thereby reducing the stray light. The topside of the filter element 414 is also provided with the top side lightshielding layer 4143 to enhance the effect of eliminating stray light.

It can be understood that, in the embodiments shown in FIGS. 28 to 33 ,the wiring direction of the connecting wire 415 is from thephotosensitive element 413 to the circuit board 411, that is, byproviding a photosensitive element connecting plate on thephotosensitive element 413, a top end of the photosensitive elementconnecting plate is wired to form a first end of the connection line 415connected to the photosensitive element connecting plate, and then apreset position is raised, and then moved toward the circuit boardconnecting plate on the circuit board and lowered again to form a secondend of the connecting wire 415 connected to the circuit board connectingplate at the top end of the circuit board connecting plate.

As shown in FIG. 33 , according to another variant embodiment of theabove-mentioned third preferred embodiment of the present application,the electronic components 4112 of the circuit board 411 of thephotosensitive assemble 410 of the camera module 400 are mounted on thebottom side of the circuit board, the photosensitive assembly 410accordingly further includes one or more bottom side molding portions419, which integrally embed the electronic component 4112. That is, theelectronic component 4112 is not mounted on the top side of the circuitboard 411, these electronic components 4112 are provided on the bottomside of the circuit board 411, and by the bottom side molding portion419, they can be multiple independent parts, and can also form anintegrally molding base, which embed the electronic component 4112 toform a flat support surface on the bottom side. The bottom side moldingportion 419 and the molding base 412 may be formed independently, or maybe formed in a single molding process. For example, the circuit board411 may have perforations, and the molding material 416 can reach bothsides of the circuit board 411 during the molding process.

It can be understood that, the space on the bottom side of the circuitboard 411 under the photosensitive element 413 can also be used forarranging the electronic components 4112, so unlike the aboveembodiment, the electronic components 4112 need to be arranged aroundthe photosensitive element 413, in this embodiment, the area of thecircuit board 411 is significantly reduced.

Accordingly, the molding base 412 includes the photosensitive elementcoupling portion 41211 and the top side extending portion 41212, so thatwhen the size of the photosensitive assembly 410 is further reduced, thearea of the top surface 4124 of the molding base 412 is increased by thetop side extending portion 41212 extending in a twisted manner, so as toprovide a greater mounting surface for the lens supporting element 440and the filter element 414. In addition, the filter element 414 includesa bottom side light shielding layer 4142 and a top side light shieldinglayer 4143 provided on both sides of the filter element main body 4141,thereby enhancing the effect of eliminating the stray light.

As shown in FIG. 34 , the wired connection between the photosensitiveelement 413 and the circuit board 411 is from the circuit board 411 tothe photosensitive element 413. That is, by providing a circuit boardconnecting plate on the circuit board 411, a top end of the circuitboard connecting plate is wired to form a second end of the connectionline 415 connected to the circuit board connecting plate, and then apreset position is raised, and then moved toward the circuit boardconnecting plate and lowered again to form an opposite first end of theconnecting wire 415 connected to the photosensitive element connectingplate at the top end of the photosensitive element connecting plate, inthis way, the connecting wire 415 extends in a curved shape, and itcauses the height h2 of the top end of the connecting wire 415 to belower than the height h1 of the top end of the connecting wire in theembodiments of FIGS. 28 to 33 , taking FIG. 33 as an example, so that,in the molding process, a space needed for the light window moldingportion 4214 of the molding die 4210 to avoid the connecting wire 415 isreduced, thereby the height of the top side extending portion 41212 canbe higher.

As shown in FIGS. 35 to 37 , a camera module 400 according to a fourthpreferred embodiment of the present application is shown, wherein thecamera module 400 includes a photosensitive assembly 410 and a lens 430.The lens 430 is assembled on the photosensitive assembly to form a fixedfocus camera module. It can be understood that, in another variantembodiment, the lens may also be provided on a driver or a fixed lensbarrel to form a lens assembly, and the lens assembly is assembled onthe photosensitive assembly.

Accordingly, the photosensitive assembly 410 includes a circuit board411, a molding base 412, a photosensitive element 413, a filter element414, and a filter element holder 417, the molding base 412 includes abase main body 4121, which is integrally molded on the circuit board 411and the photosensitive element 413 and forms a light window 4122, thelight window 4122 is a closed space and provides a light path for thephotosensitive element 413.

The filter element holder 417 is assembled on the molding base 412 andhas an opening window 4171 on the bottom side and a top side mountinggroove 4172, the filter element 414 is assembled on the top sidemounting groove 4172, so that the filter element 414 assembled on thefilter element holder 417 is less likely to be damaged than the filterelement 412 directly assembled on the molding base 412.

The filter element 414 includes a filter element main body 4141, abottom side light shielding layer 4142, and a top side light shieldinglayer 4143, the light shielding layer 4142 is located on the bottom sideof the filter element main body 4141 and is located between the filterelement main body 4141 and the inner top surface of the filter elementholder 417, the light shielding layer 4142 is a light absorbingmaterial, which makes the filter element main body 4141 form a middleeffective light transmitting region 41411 and a surrounding region41412, the light passing through the lens 430 can only reach the insideof the molding base 412 through the effective light transmitting region41411. The light shielding layer 4142 has a ring structure, and anopening window is formed in the middle, that is, the light shieldinglayer 4142 forms a light path 41420 for allowing light to enter thelight window 4122 and reduce the stray light reaching the photosensitiveelement 413, and the top side light shielding layer 4143 can enhance theeffect of reducing stray light.

The photosensitive element 413 has a photosensitive region 4131 in themiddle and a non-photosensitive region 4132 located around thephotosensitive region 4131, the light shielding layer 4142 has an inneredge 41421 and an outer edge 41422. The distance between the inner edge41421 of the light shielding layer 4142 and to the optical axis X isgreater than or equal to, or slightly smaller than the distance betweenthe outer edge 41311 of the photosensitive region 4131 and the opticalaxis X.

The outer edge 41422 of the light shielding layer 4142 is locatedoutside the inner edge 41701 of the top surface of the filter elementholder 417, that is, no light transmitting region is formed between theinner edge of the top surface of the filter element holder 417 and theouter edges 41422 of the light shielding layer 4142.

In this embodiment of the present application, the base main body 4121of the molding base 412 includes a plurality of segments of an innersurfaces in a circumferential direction, each of segments of the innersurface has a plurality of the portions extending in differentdirections, such as the base main body 4121 of the molding base 412includes three portions, that is, a photosensitive element couplingportion 41211 and a top side extending portion 41212 located around thelight window 4122 shown in FIGS. 36A and 36B, and a circuit boardcoupling portion 41213 on the bottom side of the photosensitive elementcoupling portion 41211. The photosensitive element coupling portion41211 has an inner surface integrally extending from the photosensitiveelement 413, and at least a segment of the inner surface integrallyextending from the photosensitive element 413 is defined as a firstportion inner surface 41231 of the molding base 412, the top sideextending portion 41212 has an inner surface extending integrally fromthe photosensitive element coupling portion 41211, and forms a secondportion inner surface 41232 of the molding base 412, the second portioninner surface 41232 is integrally extending from the first portion innersurface 41231. It can be understood that, each of the first portioninner surfaces 41231 and the second portion inner surfaces 41232 is acertain section of the inner surface of the surrounding inner surface ofthe base main body 4121; or a plurality of sections of the inner surfacehave the first portion inner surface 41231 and the second portion innersurface 41232 of the same structure; or all of the inner surfaces havethe first portion inner surface 41231 and the second portion innersurface 41232.

The inner surfaces 41231 and 41232 of the photosensitive elementcoupling portion 41211 and the top side extending portion 41212 extendat different slopes, respectively, the second portion inner surface41232 of the top side extending portion 41212 extends upward with agreater slope with respect to the first portion inner surface 41231 ofthe photosensitive element coupling portion 41211, or the second portioninner surface 41232 of the top side extending portion 41212 extendsupward without a slope, that is, the second portion inner surface 41232of the top side extending portion 41212 extends substantiallyperpendicular to the top surface of the photosensitive element 413, sothat the area of the top surface of the top side extending portion 41212can be relatively large, that is, the top surface of the top sideextending portion 41212 determines the area of the top surface 4124 ofthe molding base 412, and such extension structure of the photosensitiveelement coupling portion 41211 and the top side extending portion 41212can increase the area of the top surface 4124 of the molding base 412,so that it can provide a greater mounting area for the lens or the lensassembly or the filter element holder 417 above the photosensitiveassembly 410, for example, in this embodiment, the top surface 4124 ofthe molding base 412 allows the filter element holder 417 above to bemore firmly mounted. And such a structure can reduce the area of thefilter element 414.

That is, in order to facilitate the demolding of the molding process andprevent the stray light, the first portion inner surface 41231 definedby the structure formed by the photosensitive element coupling portion41211 for its inner surface extends obliquely upward from thephotosensitive element 413 with a relatively small slope, and the secondportion inner surface 41232 defined by the inner surface of the top sideextending portion 41212 extends integrally from the first portion innersurface 41231 in a twist manner, and extends upward with a relativelylarge slope or no slope, that is, an included angle is formed betweenthe second portion inner surface 41232 and the first portion innersurface 41231 of the molding base 412, so that, in comparison to theoblique upward extension with a fixed slope, the area of the top surface4124 of the molding base 412 can be effectively increased. It can beunderstood that, the inner surfaces of the molding base 412 extending inthe circumferential direction may all have the above mentioned firstportion inner surface 41231 and the above mentioned second portion innersurface 41232, and the first portion inner surface 41231 may have thesame included angle α, or the included angle can be different. Thesesecond portion inner surfaces 41232 may have the same angle β, or theincluded angle can be different.

As shown in FIG. 36B, an included angle of the first portion innersurface 41231 defined by the inner surface of the photosensitive elementcoupling portion 41211 relative to the optical axis X of the cameramodule 400 is α, and an included angle of the second portion innersurface 41232 defined by the inner surface of the top side extendingportion 41212 relative to the optical axis X of the camera module 400 isβ, wherein the value of α ranges from 3°˜80°, and the value of β rangesfrom 0°˜10°, and α>β.

That is, the included angle β of the second portion inner surface 41232defined by the inner surface of the top side extending portion 41212relative to the optical axis X of the camera module 400 has a smallerangle relative to the included angle α of the first portion innersurface 41231 defined by the inner surface of the photosensitive elementcoupling portion 41211 relative to the optical axis X of the cameramodule 400, so that the second portion inner surface 41232 of the topside extending portion 41212 extends upward with a greater slope or in adirection perpendicular to the photosensitive element 413, therebyincreasing the area of the top surface 4124 of the molding base 412 andreducing the area of the filter element, and reducing the possibility ofgenerating “flashing” of the molding material 416 during the moldingprocess.

As shown in FIG. 36B, in this preferred embodiment of the presentapplication, preferably, the value of the thickness H1 of thephotosensitive element coupling portion 41211 ranges from 0.05 mm˜0.7mm, and the value of the thickness H2 of the top side extending portion41212 ranges from 0.02 mm˜0.6 mm.

In addition, the filter element 414 is provided with the light shieldinglayer 4142 and the top side light shielding layer 4143, and as shown inFIG. 37 , a part of the stray light L31 incidents on the upper surfaceof the filter element main body 4141 of the filter element 414 isabsorbed by the top side light shielding layer 4143, so as to block apart of the stray light.

When another part of the stray light L32 passes through the effectivelight transmitting region 41411 of the filter element main body 4141 andincidents on the first portion inner surface 41231, it will be reflectedupward to the light shielding layer 4142 by the inclined first portioninner surface 41231 of the molding base 412 or further reflected to thelight shielding layer 4142 by the second portion inner surface 41232, soas to be absorbed by light shielding layer 4142, so as not to be furtherreflected and reach the photosensitive element 413, thereby affectingthe imaging quality of the camera module 400. Accordingly, the lightshielding layer 4142 is adjacent to an inner surface 41702 of the filterelement holder 417 located below the filter element, and the innersurface 41702 of the filter element holder 417 located below the filterelement extends downward from the light shielding layer 4142, and alight suppression groove 41221 is formed on the light shielding layer4142, on the inner surface 41702 of the filter element holder 417 belowthe filter element, between the first portion inner surface 41231 andthe second portion inner surface 41232, on the outer side portion of thelight window 4122, and the light suppression groove 41221 is a space forsuppressing the emission of the stray light. More specifically, as shownin FIG. 37 , the stray light L32 enters the light suppression groove41221, so that it cannot be emitted in the light suppression groove41221.

As shown in FIG. 38 , according to a variant embodiment of the abovementioned fourth preferred embodiment of the present application, a topside groove 4125 is formed on the top side of the molding base 412, andthe filter element holder 417 is assembled on the top side groove 4125to move its position downward, and the lens 430 can be assembled on thetop side of the molding base 412. That is, the top surface 4124 enlargedby the molding base 412 by multi-stage extension is used for assemblingthe filter element holder 417 and the lens 430.

As shown in FIGS. 39 to 41 , a camera module 400 according to a fifthpreferred embodiment of the present application has a structure similarto that of the fourth preferred embodiment. The camera module 400includes a photosensitive assembly 410 and a lens 430. The lens 430 isassembled on the photosensitive assembly to form a fixed focus cameramodule. It can be understood that, in another variant embodiment, thelens may also be provided on a driver or a fixed lens barrel to form alens assembly, and the lens assembly is assembled on the photosensitiveassembly.

Accordingly, the photosensitive assembly 410 includes a circuit board411, a molding base 412, a photosensitive element 413, a filter element414, and a filter element holder 417, the molding base 412 includes abase main body 4121, which is integrally molded on the circuit board 411and the photosensitive element 413 and forms a light window 4122, thelight window 4122 is a closed space and provides a light path for thephotosensitive element 413. The molding base 412 includes aphotosensitive element coupling portion 41211 and a top side extendingportion 41212 located around the light window 4122, which extends inmulti-stage, and the inner surfaces 41231 and 41232 extend in differentdirections, respectively, so that the stray light is reduced and thearea of the top surface 4124 of the molding base 412 is increased.

The filter element holder 417 is assembled on the molding base 412, andhas an opening window 4171 on the top side and a bottom side mountinggroove 4173, the filter element 414 is assembled on the bottom sidemounting groove 4173 in an inverted manner. The filter element 414includes a filter element main body 4141 and a light shielding layer4142, the light shielding layer 4142 is provided on the bottom side ofthe filter element main body 4141. Therefore, similarly, the lightshielding layer 4142 can play a role of reducing the stray lightreaching the photosensitive element 413.

In addition, the lens 430 includes a supporting member 431 and one ormore lenses 432 assembled on the supporting member 431, wherein, becausethe filter element 414 is inverted mounted on the filter element holder417, so that the filter element 414 does not protrude from the uppersurface of the filter element holder 417, the lens at the bottom of theone or more lenses 432 of the lens 430 can be relatively moved down, sothat the distance from the photosensitive element 413 is reduced,thereby reducing the back focus of the camera module 400.

When the filter element 414 is provided with light shielding layer 4142on the bottom side, as shown in FIG. 41 , a part of the stray light L41incident on the upper surface of the filter element holder 417 isreflected without entering the light window 4122 of the molding base412, so as to block a part of the stray light.

When another part of the stray light L42 passes through the effectivelight transmitting region 41411 of the filter element main body 4141 andis incident on the first portion inner surface 41231, it will bereflected upward to the light shielding layer 4142 by the inclined firstportion inner surface 41231 of the molding base 412 or further reflectedto light shielding layer 4142 by the second portion inner surface 41232,so as to be absorbed by light shielding layer 4142, so as not to befurther reflected and reach the photosensitive element 413, therebyaffecting the imaging quality of the camera module 400. Accordingly, thelight shielding layer 4142 is adjacent to the second portion innersurface 41232 of the molding base 412, the second portion inner surface41232 of the molding base 412 is from the light shielding layer 4142extends downward, and a light suppression groove 41221 is formed on thelight shielding layer 4142, between the first portion inner surface41231 and the second portion inner surface 41232, on an outer sideportion of the light window 4122, the light suppression groove 41221 isa space for suppressing the stray light. More specifically, as shown inFIG. 41 , the stray light L42 enters the light suppression groove 41221,so that it cannot be emitted from the light suppression groove 41221.

In addition, it can be understood that, because of the light shieldinglayer 4142 and the second portion inner surface 41232 of the moldingbase 412, the light shielding layer 4142 effectively reduces lightpassing through the filter element main body 4141 and reaching thesecond portion inner surface 41232, thereby preventing the lightincident on the second portion inner surface 41232 from being reflectedand reaching the photosensitive element 413 to form the stray light andaffect the imaging quality of the camera module 400.

As shown in FIG. 42 , according to another variant embodiment of thefifth embodiment of the present application, the wiring direction of theconnecting wire 415 is from the circuit board 411 to the photosensitiveelement 413, so that, in the molding process, the light window moldingportion 4214 does not need to provide an avoiding space for theconnecting wire 415 as much as possible, and the top side extendingportion 41212 is made to have a greater height to increase the area ofthe top surface 4124 of the molding base 412.

In addition, an opening window 4171 is formed on the top side of thefilter element holder 417, and the length of the top side portion 4174of the filter element holder 417 extending inward may be greater than orequal to the length of the light shielding layer 4142 extending inward,in this way, the area of the opening window 4171 may not be greater thanthe area of the light path 41420, so that the top surface of the filterelement holder 417 has the effect of blocking a part of the stray lightL51, so that it is not necessary to provide the top side light shieldinglayer 4143 on the top side of the filter element 414. The stray lightL52 can be absorbed by light shielding layer 4142.

As shown in FIG. 43 , according to another variant embodiment of thefifth embodiment of the present application, the photosensitive assembly410 includes a circuit board 411, a molding base 412, a photosensitiveelement 413, and a filter element 414, a filter element holder 417 and ablocking frame 418. The molding base 412 is integrated with the circuitboard, the photosensitive element 413 and the blocking frame 418, andthe filter element 414 is assembled on the filter element holder 417,the filter element holder 417 is assembled on the top side of themolding base 412. The light shielding layer 4142 of the filter element414 is similar to the above mentioned third preferred embodiment, and isprovided on the bottom side of the filter element main body 142 toreduce the stray light.

The ring shaped blocking frame 418 is provided on the photosensitiveelement 413, and is used to press the light window molding portion 4214on the blocking frame 418 in a molding process to prevent the fluid-likemolding material 416 from flowing into the photosensitive region 4131 ofthe photosensitive element 413, wherein the molding base 412 isintegrally molded on the circuit board, the photosensitive element 413and the blocking frame 418, the blocking frame 418 may be glue in apreferred embodiment, which may have a predetermined elasticity, forexample, the elastic modulus ranges from 0.1 Gpa to 1 Gpa.

A base main body 4121 of the molding base 412 includes a photosensitiveelement coupling portion 41211 and a top side extending portion 41212located around the light window 4122, and a circuit board couplingportion 41213 on bottom side of the photosensitive element couplingportion 41211 and around the photosensitive element 413 and on the topside of the circuit board 411. The photosensitive element couplingportion 41211 is integrally coupled to the circuit board 411, thephotosensitive element 413 and the blocking frame 418, and has a firstportion inner surface 41231 extending obliquely from the blocking frame418, the top side extending portion 41212 has a second portion innersurface 41232 that extends from the first portion inner surface 41231 ina twist manner, so that such a structure enables the reflection effectof the inclined inner surface 41231 of the first portion to reduce straylight, and the second partial surface 1232 extending in a twist mannerallows the top surface of the top side extending portion 41212 to have agreater mounting area, and reduce the area of the filter element 414,and prevent the molding material 416 from forming a “flashing” in themolding process, and the included angle of the inner surface of the twoportions relative to the optical axis X is similar to the previousembodiment. It can be understood that, the blocking frame 418 of thisembodiment can also be applied to other embodiment s of the presentapplication.

Those skilled in the art should understand that the embodiments of thepresent application shown in the above description and the accompanyingdrawings are merely examples and do not limit the present application.The object of the present application has been completely andeffectively achieved. The function and structural principle of thepresent application have been shown and explained in the embodiments,and the embodiments of the present application may have any variation ormodification without departing from the principle.

The invention claimed is:
 1. A method for manufacturing a photosensitiveassembly of a camera module, comprising following steps: (a) fixing acircuit board jointed panel to a second die of a molding die, whereinthe circuit board jointed panel includes one or more rows of circuitboards, and each row of the circuit boards includes one or more circuitboards arranged side by side, each of the circuit boards includes arigid region and a flexible region combined with each other, and each ofthe circuit boards is operatively connected with a photosensitiveelement, and the circuit board includes a plurality of electroniccomponents formed on the rigid region; (b) clamping the second die and afirst die, and filling a molten molding material in a base jointed panelmolding guide groove in the molding die, wherein a positioncorresponding to at least one light window molding portion is preventedfrom filling with the molding material; and (c) curing the moldingmaterial in the base jointed panel molding guide groove to form aone-piece molding base at a position corresponding to the base jointedpanel molding guide groove, wherein the one-piece molding base isintegrally molded on corresponding one or more rows of the circuit boardand one or more rows of the photosensitive elements to form aphotosensitive assembly jointed panel and forms a light window thatprovides a light path for each of the photosensitive elements at aposition corresponding to the light window molding portion, wherein thebase jointed panel molding guide groove has a first diversion groovecorresponding to a first end side of the one-piece molding base adjacentto the flexible region and a second diversion groove corresponding tothe one-piece molding base away from the flexible region, and aplurality of the filling grooves extending between the first diversiongroove and the second diversion groove, wherein the plurality ofelectronic components are not provided in the first diversion groove andthe second diversion groove, and are collectively provided in theplurality of filling grooves and integrally embedded by the one-piecemolding base.
 2. The method according to claim 1, further comprising astep of: cutting the photosensitive assembly jointed panel to obtain aplurality of photosensitive assemblies, wherein each of thephotosensitive assemblies includes the circuit board, the photosensitiveelement, and the molding base, wherein the molding base is integrallymolded on the circuit board and the photosensitive element and forms thelight window that provides the light path for the photosensitiveelement.
 3. The method according to claim 1, wherein the rigid region ofthe circuit board has a first end side corresponding to the one-piecemolding base adjacent to the flexible region, and an opposite second endside corresponding to the one-piece molding base away from the flexibleregion, and two wing side on both sides of the photosensitive elementexcept for the first end side and the second end side.
 4. The methodaccording to claim 3, wherein the plurality of electronic components areprovided on at least one wing side except for the first end side and thesecond end side.
 5. The method according to claim 1, wherein the firstdiversion groove has a first side surface facing the light window, thesecond diversion groove has a second side surface facing the lightwindow, wherein the first side surface includes a first partial surfaceprovided adjacent to the photosensitive element and a second partialsurface connected to the first partial surface, and the second sidesurface has a third partial surface provided adjacent to thephotosensitive element and a fourth partial surface connected to thethird partial surface, wherein a first angle of the first partialsurface relative to an optical axis of the camera module is greater thana second angle of the second partial surfaces relative to the opticalaxis, and a third angle of the third partial surface relative to theoptical axis is greater than a fourth angle of the fourth partialsurface relative to the optical axis.
 6. The method according to claim5, wherein a first height of the first partial surface in a directionperpendicular to the surface of the photosensitive element and a thirdheight of the third partial surface in the direction are 0.05 mm˜0.7 mmrespectively.
 7. The method according to claim 5, wherein a secondheight of the second partial surface in a direction perpendicular to thesurface of the photosensitive element and a fourth height of the fourthpartial surface in the direction are 0.02 mm˜0.6 mm.
 8. The methodaccording to claim 1, wherein the circuit board and the correspondingphotosensitive element are connected by a series of connecting wiresembedded by the molding base, and a position for connecting the firstpartial surface and the second partial surface is at an inner side ofthe connecting wire at the first side surface, and a position forconnecting the third partial surface and the fourth partial surface isat an inner side of the connecting wire at the second side surface. 9.The method according to claim 8, wherein the series of connecting wiresare provided on four sides of the photosensitive element.
 10. The methodaccording to claim 8, wherein the series of connecting wires arecollectively provided on both wing sides of the rigid region of thecircuit board.
 11. A photosensitive assembly of a camera module,comprising: a circuit board, including a rigid region and a flexibleregion combined with each other; a photosensitive element; and a moldingbase, wherein the molding base is integrally molded on the circuit boardand the photosensitive element and forms a light window that provides alight path for the photosensitive element; wherein the rigid region ofthe circuit board has a first end side corresponding to the molding baseadjacent to the flexible region, and an opposite second end sidecorresponding to the molding base away from the flexible region, and twowing side on both sides of the photosensitive element except for thefirst end side and the second end side; wherein the circuit boardinclude a plurality of electronic components provided on the rigidregion, and the plurality of electronic components are provided on atleast one wing side except for the first end side and the second endside and are integrally embedded by the molding base.
 12. Thephotosensitive assembly according to claim 11, wherein the first endside corresponding to the molding base adjacent to the flexible regionhas a first side surface facing the light window, and the first sidesurface includes a first partial surface provided adjacent to thephotosensitive element and a second partial surface connected to thesecond partial surface, and a first angle of the first partial surfacerelative to an optical axis of the camera module is greater than asecond angle of the second partial surface relative to the optical axis;and the opposite second end side corresponding to the molding base awayfrom the flexible region has a second side surface facing the lightwindow, the second side surface includes a third partial surfaceprovided adjacent to the photosensitive element and a fourth partialsurface connected to the third partial surface, and a third angle of thethird partial surface relative to the optical axis is greater than afourth angle of the fourth partial surface relative to the optical axis.13. The photosensitive assembly according to claim 12, wherein a firstheight of the first partial surface in a direction perpendicular to thesurface of the photosensitive element and a third height of the thirdpartial surface in the direction are 0.05 mm˜0.7 mm.
 14. Thephotosensitive assembly according to claim 12, wherein a second heightof the second partial surface in a direction perpendicular to thesurface of the photosensitive element and a fourth height of the fourthpartial surface in the direction are 0.02 mm˜0.6 mm.
 15. Thephotosensitive assembly according to claim 11, wherein the circuit boardand the corresponding photosensitive element are connected by a seriesof connecting wires embedded by the molding base, and a position forconnecting the first partial surface and the second partial surface isat an inner side of the connecting wire at the first side surface, and aposition for connecting the third partial surface and the fourth partialsurface is at an inner side of the connecting wire at the second sidesurface.
 16. The photosensitive assembly according to claim 15, whereinthe series of connecting wires are provided on four sides of thephotosensitive element.
 17. The photosensitive assembly according toclaim 15, wherein the series of connecting wires are collectivelyprovided on both wing sides of the rigid region of the circuit board.18. The photosensitive assembly according to claim 11, further includesa filter element, the filter element is mounted on a top side of themolding base.
 19. The photosensitive assembly according to claim 18,wherein the filter element includes a filter element main body and atleast one light shielding layer provided on at least one of a top sideand a bottom side of the filter element main body.